DRAM, 1MX32, 100ns, CMOS, PDIP48
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | APTA Group Inc |
package instruction | DIP, DIP48,.9 |
Reach Compliance Code | unknow |
Maximum access time | 100 ns |
I/O type | COMMON |
JESD-30 code | R-PDIP-T48 |
JESD-609 code | e0 |
memory density | 33554432 bi |
Memory IC Type | OTHER DRAM |
memory width | 32 |
Number of terminals | 48 |
word count | 1048576 words |
character code | 1000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX32 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP48,.9 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum standby current | 0.11 A |
Maximum slew rate | 0.725 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MD321000FKX-10/AD7 | MD321000FKX-10/AD6 | MD321000FKX-12/AD7 | MD321000FKX-10/AD4 | |
---|---|---|---|---|
Description | DRAM, 1MX32, 100ns, CMOS, PDIP48 | DRAM, 1MX32, 100ns, CMOS, PDIP48 | DRAM, 1MX32, 120ns, CMOS, PDIP48 | DRAM, 1MX32, 100ns, CMOS, PDIP48 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP48,.9 | DIP, DIP48,.9 | DIP, DIP48,.9 | DIP, DIP48,.9 |
Reach Compliance Code | unknow | unknown | unknown | unknown |
Maximum access time | 100 ns | 100 ns | 120 ns | 100 ns |
I/O type | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 |
JESD-609 code | e0 | e0 | e0 | e0 |
memory density | 33554432 bi | 33554432 bit | 33554432 bit | 33554432 bit |
Memory IC Type | OTHER DRAM | OTHER DRAM | OTHER DRAM | OTHER DRAM |
memory width | 32 | 32 | 32 | 32 |
Number of terminals | 48 | 48 | 48 | 48 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP48,.9 | DIP48,.9 | DIP48,.9 | DIP48,.9 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 1024 | 1024 | 1024 | 1024 |
Maximum standby current | 0.11 A | 0.11 A | 0.11 A | 0.11 A |
Maximum slew rate | 0.725 mA | 0.725 mA | 0.645 mA | 0.725 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maker | APTA Group Inc | - | APTA Group Inc | APTA Group Inc |