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210R1602JGL

Description
RESISTOR, NETWORK, FILM, DIVIDER, 0.25W, SURFACE MOUNT, CHIP
CategoryPassive components    The resistor   
File Size396KB,1 Pages
ManufacturerCalifornia Micro Devices
Download Datasheet Parametric View All

210R1602JGL Overview

RESISTOR, NETWORK, FILM, DIVIDER, 0.25W, SURFACE MOUNT, CHIP

210R1602JGL Parametric

Parameter NameAttribute value
MakerCalifornia Micro Devices
package instruction,
Reach Compliance Codeunknow
ECCN codeEAR99
The first element resistor4000 Ω
JESD-609 codee4
Manufacturer's serial number210R
Installation featuresSURFACE MOUNT
Network TypeDIVIDER
Number of components12
Number of functions1
Number of terminals13
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
Resistor typeARRAY/NETWORK RESISTOR
Second/last element resistor4000 Ω
surface mountYES
technologyTHIN FILM
Temperature Coefficient250 ppm/°C
Terminal surfaceGOLD
Terminal shapeONE SURFACE
Tolerance5%
Operating Voltage100 V

210R1602JGL Preview

CALIFORNIA MICRO DEVICES
210R
THIN FILM RESISTOR SERIES
California Micro Devices’ 210R Series multi-terminal resistor chip offers the hybrid designer a component that provides a
wide range of resistance values on a single chip. Bonding pads segment the total resistance into five single elements of
resistance and seven 5X elements of resistance enabling the combination to cover the resistance range from 800 ohms to
240K ohms.
Parameter
TCR
Operating Voltage
Package
ating per re
Power R
Power
(
Rating
sistor)
Thermal Shock
High Temperature Exposure
Moisture Resistance
Life
Noise
Insulation Resistance
ELECTRICAL SPECIFICATIONS
Test Condition
-55°C to +125°C
-55°C to +125°C
@ 70°C (D erate linearly to zero @ 150° C )
Method 107 MIL-STD -202F
100 Hrs @ 150° C A m b i e n t
Method 106 MIL-STD -202F
Method 108 MIL-STD -202F (125° C / 1 0 0 0 h r )
Method 308 MIL-STD -202F
@ 25° C
0 to -250ppm/°C
100Vdc
250mw
±0.25% @
∆R
±0.25%
∆R
±0.5%
∆R
±0.5%
∆R
-20dB
1
×
1 0
12
Max
Max
Max
Max
Max
Max
Max
Max
Min
PAD 1
PAD 13
PAD 8
Part Number
2 10 R
2 10 R
2 10 R
2 10 R
2 10 R
2 10 R
8000X
2 40 0 X
8 0 0 1X
8002X
16 0 2 X
2 40 3 X
VALUES
Total
Nominal/Single
Resistance
Element of Resistance
800
2 40 0
8000
80000
16 0 0 0 0
2 40 0 0 0
20
60
200
2000
40 0 0
6000
Formats
Die Size:
30±3 mils square
Bonding Pads:
4x4 mils typical
MECHANICAL SPECIFICATIONS
Substrate
Isolation Layer
Backing
Metalization
Silicon 10±2 mils thick
S
i
0
2
100,000Å thick, min
Lapped (gold optional)
Aluminum 10,000Å thick, min
(15,000Å gold optional)
PACKAGING
Two inch square trays of 400 chips maximum.
NOTE S
1. The tolerance applies to the total resistance value only.
2. Resistor pattern may vary from one value to another.
210R
Series
8502
Value
First 3 digits are
significant value.
Last digit represents
number of zeros.
R indicates decimal point
PART NUMBER DESIGNATION
X
G
Tolerance
J = ±5%
K = ±10%
M = ±20%
B o n d P a ds
G = Go l d
No Letter = Aluminum
Backing
W = Go l d
L = Lapped
No Letter = Either
W
© 2002 California Micro Devices Corp. All rights reserved.
3/02
C0740400
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com


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