EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

12062R471JCB30D

Description
Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00047uF, Surface Mount, 1206, CHIP
CategoryPassive components    capacitor   
File Size365KB,25 Pages
ManufacturerYAGEO
Websitehttp://www.yageo.com/
Environmental Compliance
Download Datasheet Parametric View All

12062R471JCB30D Overview

Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.00047uF, Surface Mount, 1206, CHIP

12062R471JCB30D Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerYAGEO
package instruction, 1206
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.00047 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.85 mm
JESD-609 codee3
length3.2 mm
Manufacturer's serial numberX7R
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, PAPER, 13 INCH
positive tolerance5%
Rated (DC) voltage (URdc)250 V
seriesSIZE(MID-VOLTAGE)
size code1206
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width1.6 mm
How is the precise measurement of the Wheatstone bridge demonstrated?
When measuring resistance values, the Wheatstone bridge is often mentioned. Why can using it improve the test accuracy? If you want to measure resistance, two resistors can also be measured. Are the f...
sfcsdc Analog electronics
Pnp Darlington tube cannot be driven
The bd682 pnp Darlington tube cannot be driven. A 1k resistor is connected in series with the B pole, the E pole is 5V, and there is no output voltage at the C pole?...
冰魄3009 Analog electronics
Giant 555 Timer
Large 555...
dcexpert DIY/Open Source Hardware
[BearPi-HM Nano] Burning system and the first program
In the previous article, the system has been successfully compiled. To verify whether the result is correct, the compiled system needs to be burned into the development board for further verification....
sumoon_yao ARM Technology
Implementing Low-Cost Automotive Multi-Bus Bridging Using FPGAs
The number of electronic units in automobiles continues to grow rapidly, so it is instructive to compare the development of automotive electronics with the development of consumer electronic portable ...
frozenviolet Automotive Electronics
Possible bottlenecks in the development of RFID
(I) Privacy issues: A survey jointly conducted by RFID Journal and market research organization ABI, called "RFID Journal Live", shows that "the biggest benefit of using RFID technology is that it can...
tmily RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号