EEWORLDEEWORLDEEWORLD

Part Number

Search

HPS05236044DPB19

Description
Fixed Resistor, Metal Glaze/thick Film, 4W, 6040000ohm, 2000V, 0.5% +/-Tol, -150,150ppm/Cel,
CategoryPassive components    The resistor   
File Size68KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

HPS05236044DPB19 Overview

Fixed Resistor, Metal Glaze/thick Film, 4W, 6040000ohm, 2000V, 0.5% +/-Tol, -150,150ppm/Cel,

HPS05236044DPB19 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerVishay
Reach Compliance Codecompli
structureCoated
JESD-609 codee8
Lead diameter0.8 mm
Lead length25 mm
Number of terminals2
Maximum operating temperature200 °C
Minimum operating temperature-55 °C
Package diameter5 mm
Package length23 mm
Package formAxial
method of packingBlister Pack
Rated power dissipation(P)4 W
resistance6040000 Ω
Resistor typeFIXED RESISTOR
seriesHPS
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient-150,150 ppm/°C
Terminal surfaceTin/Silver/Copper (Sn99.0Ag0.3Cu0.7)
Tolerance0.5%
Operating Voltage2000 V
HPS
Vishay Sfernice
High Ohmic Value (up to 1.5 GΩ), High Power Resistors
(up to 10 W at 25 °C) Thick Film Technology
FEATURES
RoHS for most values, please consult us
High ohmic values up to 1.5 GΩ
Power rating up to 10 W at + 25 °C
Molded or coated
Ceramic core
RoHS
COMPLIANT
DIMENSIONS
in millimeters
COATED
25 min.
ØE
A
ØB
25 min.
Ø a ± 0.02
STYLE
DIM.
A
ØB
HPS 58 HPS 63
HPS 68
HPS 523 HPS 923 HPS 932 HPS 947
23 ± 2.3 23 ± 2.5 32 ± 2.5 47 ± 2.5
5 ± 0.3
9 ± 0.5 9 ± 0.5 9 ± 0.5
0.8
6.5 ± 0.2 10 ± 0.2 15 ± 0.2
2.4 ± 0.1 3.7 ± 0.1 5.6 ± 0.3
0.6
0.24
0.29
MOLDED
0.67
45° chamfer
max. 0.25 mm deep
4
L max.
4
Ø E ± 0.1
Weight in g
1.23
4.60
5.27
7.18
MOLDED
25 min.
A
25 min.
Finish
COATED
ØE
ØB
TECHNICAL SPECIFICATIONS
SERIES AND STYLES
Power Rating at + 25 °C
Ohmic Range
Tolerance
Temperature Coefficient
Limiting Element Voltage
Critical Resistance
Climatic Category
0.3 kV
90 kΩ
0.7 kV
245 kΩ
1.5 kV
750 kΩ
HPS 58
1W
200
Ω
100 MΩ
HPS 63
2W
200
Ω
175 MΩ
HPS 68
3W
300
Ω
400 MΩ
HPS 523
4W
800
Ω
650 MΩ
± 0.5 % to ± 10 %
± 150 ppm/°C
2 kV
1 MΩ
2.5 kV
1.041 MΩ
5 kV
3.125 MΩ
8 kV
6.4 MΩ
HPS 923
6W
1 kΩ
1 GΩ
HPS 932
8W
1 kΩ
1 GΩ
HPS 947
10 W
2 kΩ
1.5 GΩ
- 55 °C/+ 200 °C/56 days
MARKING
GEKA trade-mark, series, style, nominal resistance (in
Ω),
tolerance (in %), letter P for TCR ± 150 ppm/°C, manufacturing date.
Because of lack of space, small styles are marked with ohmic value (in
Ω),
tolerance (in %) and letter P.
ORDERING INFORMATION
HPS
MODEL
68
SIZE
50 MΩ
OHMIC VALUE
10 %
TOLERANCE
150 ppm/°C
TEMPERATURE
COEFFICIENT
BL20
PACKAGING
e1
LEAD (Pb)-FREE
www.vishay.com
46
For technical questions, contact: sfer@vishay.com
Document Number: 52015
Revision: 09-Jun-08
What do RF engineers do all day?
First of all, RF engineers must master the technology of circuit system analysis, which is also an indispensable part of engineering. In some communication equipment companies' projects, RF engineers ...
btty038 PCB Design
【RVB2601 Creative Application Development】Work Submission
Cold chain intelligent management system based on CH2601 Author: Liu JianhuaProject BackgroundThe author has been engaged in immunization planning for a long time. The top priority of immunization pla...
lugl4313820 XuanTie RISC-V Activity Zone
[TI recommended course] #Switch-mode power converter compensation is simple and easy#
//training.eeworld.com.cn/TI/show/course/4099...
alexpch TI Technology Forum
[Silicon Labs BG22-EK4108A Bluetooth Development Review] 5. Automatically Create a Serial Printing Project
Serial port printing log is one of the commonly used debugging methods. This post attempts to use SSV5 graphical IDE to configure the serial port. The code that the user needs to write in the whole pr...
dql2016 Development Kits Review Area
[RVB2601 Creative Application Development] + Unboxing and Trial
[i=s]This post was last edited by symic on 2022-3-1 21:31[/i]I have heard of the name of Pingtou Ge for a long time, and finally I have the opportunity to try it out. After an agonizing wait, I finall...
symic XuanTie RISC-V Activity Zone
Causes and solutions for DSP chip cold soldering
The cold solder joint depends on the package. DSP chips are commonly LQFP or FBQA. The cold solder joint of a single chip is not difficult to solve. It can be solved by adding tin and dragging solder....
fish001 DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号