S29GL01GP11FFCR10 datasheet, PDF

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S29GL01GP11FFCR10: DescriptionFlash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64; Categorystorage storage; File Size2MB，81 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29GL01GP11FFCR10 Overview

Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64

S29GL01GP11FFCR10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64
Contacts	64
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	110 ns
Spare memory width	8
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
JESD-609 code	e1
length	13 mm
memory density	1073741824 bi
Memory IC Type	FLASH
memory width	1
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1K
Number of terminals	64
word count	1073741824 words
character code	1000000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	1GX1
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
page size	8/16 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	128K
Maximum standby current	0.000005 A
Maximum slew rate	0.11 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	11 mm

S29GL01GP11FFCR10 Related Products

	S29GL01GP11FFCR10	S29GL128P90TFCR20	S29GL01GP11FFIR20	S29GL256P10TFI020	S29GL256P10FFI020	S29GL256P90FFIR20	S29GL256P90TFCR10
Description	Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64	Flash, 128MX1, 90ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56	Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64	Flash, 256MX1, 100ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56	Flash, 256MX1, 100ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64	Flash, 256MX1, 90ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64	Flash, 256MX1, 90ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	TSOP1	BGA	TSOP1	BGA	BGA	TSOP1
package instruction	13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64	HTSSOP, TSSOP56,.8,20	13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64	HTSSOP, TSSOP56,.8,20	13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64	13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64	HTSSOP, TSSOP56,.8,20
Contacts	64	56	64	56	64	64	56
Reach Compliance Code	unknow	unknown	unknown	unknown	unknow	unknow	unknow
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	110 ns	90 ns	110 ns	100 ns	100 ns	90 ns	90 ns
Spare memory width	8	8	8	8	8	8	8
command user interface	YES	YES	YES	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES	YES	YES	YES
Data polling	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	R-PBGA-B64	R-PDSO-G56	R-PBGA-B64	R-PDSO-G56	R-PBGA-B64	R-PBGA-B64	R-PDSO-G56
JESD-609 code	e1	e3	e1	e3	e1	e1	e3
length	13 mm	18.4 mm	13 mm	18.4 mm	13 mm	13 mm	18.4 mm
memory density	1073741824 bi	134217728 bit	1073741824 bit	268435456 bit	268435456 bi	268435456 bi	268435456 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	1	1	1	1	1	1	1
Humidity sensitivity level	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1
Number of departments/size	1K	128	1K	256	256	256	256
Number of terminals	64	56	64	56	64	64	56
word count	1073741824 words	134217728 words	1073741824 words	268435456 words	268435456 words	268435456 words	268435456 words
character code	1000000000	128000000	1000000000	256000000	256000000	256000000	256000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-
organize	1GX1	128MX1	1GX1	256MX1	256MX1	256MX1	256MX1
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	HTSSOP	LBGA	HTSSOP	LBGA	LBGA	HTSSOP
Encapsulate equivalent code	BGA64,8X8,40	TSSOP56,.8,20	BGA64,8X8,40	TSSOP56,.8,20	BGA64,8X8,40	BGA64,8X8,40	TSSOP56,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	GRID ARRAY, LOW PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
page size	8/16 words	8/16 words	8/16 words	8/16 words	8/16 words	8/16 words	8/16 words
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260
power supply	3.3 V	3.3 V	3.3 V	3/3.3 V	3/3.3 V	3.3 V	3.3 V
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES
Maximum seat height	1.4 mm	1.2 mm	1.4 mm	1.2 mm	1.4 mm	1.4 mm	1.2 mm
Department size	128K	128K	128K	128K	128K	128K	128K
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.11 mA	0.11 mA	0.11 mA	0.11 mA	0.11 mA	0.11 mA	0.11 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	2.7 V	2.7 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3 V	3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	OTHER
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Matte Tin (Sn)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Matte Tin (Sn)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Matte Tin (Sn)
Terminal form	BALL	GULL WING	BALL	GULL WING	BALL	BALL	GULL WING
Terminal pitch	1 mm	0.5 mm	1 mm	0.5 mm	1 mm	1 mm	0.5 mm
Terminal location	BOTTOM	DUAL	BOTTOM	DUAL	BOTTOM	BOTTOM	DUAL
Maximum time at peak reflow temperature	40	40	40	40	40	40	40
switch bit	YES	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	11 mm	14 mm	11 mm	14 mm	11 mm	11 mm	14 mm
Maker	SPANSION	-	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION

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