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S29GL128P90TFCR20

Description
Flash, 128MX1, 90ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56
Categorystorage    storage   
File Size2MB,81 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance  
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S29GL128P90TFCR20 Overview

Flash, 128MX1, 90ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56

S29GL128P90TFCR20 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeTSOP1
package instructionHTSSOP, TSSOP56,.8,20
Contacts56
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time90 ns
Spare memory width8
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G56
JESD-609 codee3
length18.4 mm
memory density134217728 bit
Memory IC TypeFLASH
memory width1
Humidity sensitivity level3
Number of functions1
Number of departments/size128
Number of terminals56
word count134217728 words
character code128000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature
organize128MX1
Package body materialPLASTIC/EPOXY
encapsulated codeHTSSOP
Encapsulate equivalent codeTSSOP56,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
page size8/16 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size128K
Maximum standby current0.000005 A
Maximum slew rate0.11 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
switch bitYES
typeNOR TYPE
width14 mm
Base Number Matches1

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Description Flash, 128MX1, 90ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 Flash, 256MX1, 100ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 Flash, 1GX1, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 Flash, 256MX1, 100ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 Flash, 256MX1, 90ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 Flash, 256MX1, 90ns, PDSO56, 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Parts packaging code TSOP1 BGA TSOP1 BGA BGA BGA TSOP1
package instruction HTSSOP, TSSOP56,.8,20 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 HTSSOP, TSSOP56,.8,20 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 HTSSOP, TSSOP56,.8,20
Contacts 56 64 56 64 64 64 56
Reach Compliance Code unknown unknown unknown unknow unknow unknow unknow
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 90 ns 110 ns 100 ns 110 ns 100 ns 90 ns 90 ns
Spare memory width 8 8 8 8 8 8 8
command user interface YES YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES YES
Data polling YES YES YES YES YES YES YES
JESD-30 code R-PDSO-G56 R-PBGA-B64 R-PDSO-G56 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PDSO-G56
JESD-609 code e3 e1 e3 e1 e1 e1 e3
length 18.4 mm 13 mm 18.4 mm 13 mm 13 mm 13 mm 18.4 mm
memory density 134217728 bit 1073741824 bit 268435456 bit 1073741824 bi 268435456 bi 268435456 bi 268435456 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 1 1 1 1 1 1 1
Humidity sensitivity level 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1
Number of departments/size 128 1K 256 1K 256 256 256
Number of terminals 56 64 56 64 64 64 56
word count 134217728 words 1073741824 words 268435456 words 1073741824 words 268435456 words 268435456 words 268435456 words
character code 128000000 1000000000 256000000 1000000000 256000000 256000000 256000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C - -40 °C -40 °C -
organize 128MX1 1GX1 256MX1 1GX1 256MX1 256MX1 256MX1
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HTSSOP LBGA HTSSOP LBGA LBGA LBGA HTSSOP
Encapsulate equivalent code TSSOP56,.8,20 BGA64,8X8,40 TSSOP56,.8,20 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 TSSOP56,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
page size 8/16 words 8/16 words 8/16 words 8/16 words 8/16 words 8/16 words 8/16 words
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260
power supply 3.3 V 3.3 V 3/3.3 V 3.3 V 3/3.3 V 3.3 V 3.3 V
Programming voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES YES YES
Maximum seat height 1.2 mm 1.4 mm 1.2 mm 1.4 mm 1.4 mm 1.4 mm 1.2 mm
Department size 128K 128K 128K 128K 128K 128K 128K
Maximum standby current 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A
Maximum slew rate 0.11 mA 0.11 mA 0.11 mA 0.11 mA 0.11 mA 0.11 mA 0.11 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 2.7 V 3 V 2.7 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3 V 3.3 V 3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER INDUSTRIAL INDUSTRIAL OTHER INDUSTRIAL INDUSTRIAL OTHER
Terminal surface Matte Tin (Sn) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Matte Tin (Sn) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) Matte Tin (Sn)
Terminal form GULL WING BALL GULL WING BALL BALL BALL GULL WING
Terminal pitch 0.5 mm 1 mm 0.5 mm 1 mm 1 mm 1 mm 0.5 mm
Terminal location DUAL BOTTOM DUAL BOTTOM BOTTOM BOTTOM DUAL
Maximum time at peak reflow temperature 40 40 40 40 40 40 40
switch bit YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 14 mm 11 mm 14 mm 11 mm 11 mm 11 mm 14 mm
Maker - SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION
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