Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | MODULE |
package instruction | DIMM, DIMM144,32 |
Contacts | 144 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
access mode | SINGLE BANK PAGE BURST |
Maximum access time | 5.4 ns |
Other features | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | R-XDMA-N144 |
memory density | 1073741824 bi |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 64 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 144 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16MX64 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM144,32 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 8192 |
self refresh | YES |
Maximum standby current | 0.008 A |
Maximum slew rate | 0.88 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
M464S1654CTS-L7C | M464S1654CTS-C7C | M464S1654CTS-C7A | 16-DAJD-A25-XX | M464S1654CTS-C1H | M464S1654CTS-L1L | M464S1654CTS-L1H | M464S1654CTS-C1L | |
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Description | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144 | MINIATURE ROTARY SWITCH | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 |
Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible | incompatible |
Maker | SAMSUNG | SAMSUNG | SAMSUNG | - | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
Parts packaging code | MODULE | MODULE | MODULE | - | MODULE | MODULE | MODULE | MODULE |
package instruction | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | - | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 |
Contacts | 144 | 144 | 144 | - | 144 | 144 | 144 | 144 |
Reach Compliance Code | compli | compliant | compliant | - | compliant | compliant | compliant | compli |
ECCN code | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | - | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
Maximum access time | 5.4 ns | 5.4 ns | 5.4 ns | - | 6 ns | 6 ns | 6 ns | 6 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 133 MHz | 133 MHz | 133 MHz | - | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
I/O type | COMMON | COMMON | COMMON | - | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | - | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
memory density | 1073741824 bi | 1073741824 bit | 1073741824 bit | - | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bi |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | - | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 64 | 64 | 64 | - | 64 | 64 | 64 | 64 |
Humidity sensitivity level | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
Number of terminals | 144 | 144 | 144 | - | 144 | 144 | 144 | 144 |
word count | 16777216 words | 16777216 words | 16777216 words | - | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
character code | 16000000 | 16000000 | 16000000 | - | 16000000 | 16000000 | 16000000 | 16000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 16MX64 | 16MX64 | 16MX64 | - | 16MX64 | 16MX64 | 16MX64 | 16MX64 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | - | DIMM | DIMM | DIMM | DIMM |
Encapsulate equivalent code | DIMM144,32 | DIMM144,32 | DIMM144,32 | - | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | - | 225 | 225 | 225 | 225 |
power supply | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 8192 | 8192 | 8192 | - | 8192 | 8192 | 8192 | 8192 |
self refresh | YES | YES | YES | - | YES | YES | YES | YES |
Maximum standby current | 0.008 A | 0.008 A | 0.008 A | - | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
Maximum slew rate | 0.88 mA | 0.88 mA | 0.8 mA | - | 0.76 mA | 0.76 mA | 0.76 mA | 0.76 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO | - | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |