GT28F800B3B110 datasheet, PDF - EEWORLD Datasheet

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GT28F800B3B110: Description512KX16 FLASH 3V PROM, 110ns, PBGA48, CSP, MICRO, BGA-48; Categorystorage storage; File Size2MB，65 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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GT28F800B3B110 Overview

512KX16 FLASH 3V PROM, 110ns, PBGA48, CSP, MICRO, BGA-48

GT28F800B3B110 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	CSP, MICRO, BGA-48
Contacts	48
Reach Compliance Code	unknow
Maximum access time	110 ns
Other features	BOTTOM BOOT BLOCK
JESD-30 code	R-PBGA-B48
JESD-609 code	e0
memory density	8388608 bi
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	NOT SPECIFIED
Number of functions	1
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	3 V
Certification status	COMMERCIAL
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED

GT28F800B3B110 Related Products

	GT28F800B3B110	GT28F800B3T90	GT28F800B3T110	GT28F008B3B110	GT28F008B3T110
Description	512KX16 FLASH 3V PROM, 110ns, PBGA48, CSP, MICRO, BGA-48	512KX16 FLASH 3V PROM, 90ns, PBGA48, CSP, MICRO, BGA-48	512KX16 FLASH 3V PROM, 110ns, PBGA48, CSP, MICRO, BGA-48	Flash, 1MX8, 110ns, PBGA48, CSP, MICRO, BGA-48	Flash, 1MX8, 110ns, PBGA48, CSP, MICRO, BGA-48
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	CSP, MICRO, BGA-48	CSP, MICRO, BGA-48	CSP, MICRO, BGA-48	CSP, MICRO, BGA-48	CSP, MICRO, BGA-48
Contacts	48	48	48	48	48
Reach Compliance Code	unknow	unknown	unknown	unknow	unknow
Maximum access time	110 ns	90 ns	110 ns	110 ns	110 ns
Other features	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
JESD-609 code	e0	e0	e0	e0	e0
memory density	8388608 bi	8388608 bit	8388608 bit	8388608 bi	8388608 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	8	8
Number of functions	1	1	1	1	1
Number of terminals	48	48	48	48	48
word count	524288 words	524288 words	524288 words	1048576 words	1048576 words
character code	512000	512000	512000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	512KX16	512KX16	512KX16	1MX8	1MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Programming voltage	3 V	3 V	3 V	3 V	3 V
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm	1 mm	1 mm	1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Humidity sensitivity level	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-

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