512KX16 FLASH 3V PROM, 110ns, PBGA48, CSP, MICRO, BGA-48
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
Parts packaging code | BGA |
package instruction | CSP, MICRO, BGA-48 |
Contacts | 48 |
Reach Compliance Code | unknown |
Maximum access time | 110 ns |
Other features | TOP BOOT BLOCK |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e0 |
memory density | 8388608 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | NOT SPECIFIED |
Number of functions | 1 |
Number of terminals | 48 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 3 V |
Certification status | COMMERCIAL |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
GT28F800B3T110 | GT28F800B3T90 | GT28F008B3B110 | GT28F008B3T110 | GT28F800B3B110 | |
---|---|---|---|---|---|
Description | 512KX16 FLASH 3V PROM, 110ns, PBGA48, CSP, MICRO, BGA-48 | 512KX16 FLASH 3V PROM, 90ns, PBGA48, CSP, MICRO, BGA-48 | Flash, 1MX8, 110ns, PBGA48, CSP, MICRO, BGA-48 | Flash, 1MX8, 110ns, PBGA48, CSP, MICRO, BGA-48 | 512KX16 FLASH 3V PROM, 110ns, PBGA48, CSP, MICRO, BGA-48 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Parts packaging code | BGA | BGA | BGA | BGA | BGA |
package instruction | CSP, MICRO, BGA-48 | CSP, MICRO, BGA-48 | CSP, MICRO, BGA-48 | CSP, MICRO, BGA-48 | CSP, MICRO, BGA-48 |
Contacts | 48 | 48 | 48 | 48 | 48 |
Reach Compliance Code | unknown | unknown | unknow | unknow | unknow |
Maximum access time | 110 ns | 90 ns | 110 ns | 110 ns | 110 ns |
Other features | TOP BOOT BLOCK | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | TOP BOOT BLOCK | BOTTOM BOOT BLOCK |
JESD-30 code | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
memory density | 8388608 bit | 8388608 bit | 8388608 bi | 8388608 bi | 8388608 bi |
Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH |
memory width | 16 | 16 | 8 | 8 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 48 | 48 | 48 | 48 | 48 |
word count | 524288 words | 524288 words | 1048576 words | 1048576 words | 524288 words |
character code | 512000 | 512000 | 1000000 | 1000000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 512KX16 | 512KX16 | 1MX8 | 1MX8 | 512KX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Programming voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
Certification status | COMMERCIAL | COMMERCIAL | Not Qualified | Not Qualified | COMMERCIAL |
Maximum seat height | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES | YES |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Humidity sensitivity level | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |