IC,COUNTER,UP/DOWN,DECADE,ALS-TTL,DIP,16PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknow |
Counting direction | BIDIRECTIONAL |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Load/preset input | YES |
Logic integrated circuit type | DECADE COUNTER |
Operating mode | SYNCHRONOUS |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
54ALS190/BEBJC | SN54ALS190J | SN74ALS190NS | SN74ALS191N | |
---|---|---|---|---|
Description | IC,COUNTER,UP/DOWN,DECADE,ALS-TTL,DIP,16PIN,CERAMIC | IC,COUNTER,UP/DOWN,DECADE,ALS-TTL,DIP,16PIN,CERAMIC | IC,COUNTER,UP/DOWN,DECADE,ALS-TTL,DIP,16PIN,PLASTIC | IC,COUNTER,UP/DOWN,4-BIT BINARY,ALS-TTL,DIP,16PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknow | unknown | unknown | unknown |
Counting direction | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 |
Load/preset input | YES | YES | YES | YES |
Logic integrated circuit type | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | BINARY COUNTER |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C |
Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maker | NXP | - | NXP | NXP |