IC,COUNTER,UP/DOWN,4-BIT BINARY,ALS-TTL,DIP,16PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Counting direction | BIDIRECTIONAL |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Load/preset input | YES |
| Logic integrated circuit type | BINARY COUNTER |
| Operating mode | SYNCHRONOUS |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| SN74ALS191N | SN54ALS190J | SN74ALS190NS | 54ALS190/BEBJC | |
|---|---|---|---|---|
| Description | IC,COUNTER,UP/DOWN,4-BIT BINARY,ALS-TTL,DIP,16PIN,PLASTIC | IC,COUNTER,UP/DOWN,DECADE,ALS-TTL,DIP,16PIN,CERAMIC | IC,COUNTER,UP/DOWN,DECADE,ALS-TTL,DIP,16PIN,PLASTIC | IC,COUNTER,UP/DOWN,DECADE,ALS-TTL,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| Counting direction | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 code | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Load/preset input | YES | YES | YES | YES |
| Logic integrated circuit type | BINARY COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 125 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maker | NXP | - | NXP | NXP |
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