EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

K7N161845M-HC16T

Description
ZBT SRAM, 1MX18, 3.5ns, CMOS, PBGA119
Categorystorage    storage   
File Size356KB,20 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

K7N161845M-HC16T Overview

ZBT SRAM, 1MX18, 3.5ns, CMOS, PBGA119

K7N161845M-HC16T Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
package instructionBGA, BGA119,7X17,50
Reach Compliance Codeunknown
Maximum access time3.5 ns
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
JESD-609 codee0
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width18
Humidity sensitivity level3
Number of terminals119
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5 V
Certification statusNot Qualified
Maximum standby current0.01 A
Minimum standby current2.38 V
Maximum slew rate0.32 mA
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40

K7N161845M-HC16T Related Products

K7N161845M-HC16T K7N163645M-HC15T K7N161845M-HC13T K7N161845M-QC13T K7N161845M-QC16T K7N163645M-QC15T K7N163645M-HC13T K7N161845M-HC15T K7N163645M-QC16T
Description ZBT SRAM, 1MX18, 3.5ns, CMOS, PBGA119 ZBT SRAM, 512KX36, 3.8ns, CMOS, PBGA119 ZBT SRAM, 1MX18, 4.2ns, CMOS, PBGA119 ZBT SRAM, 1MX18, 4.2ns, CMOS, PQFP100 ZBT SRAM, 1MX18, 3.5ns, CMOS, PQFP100 ZBT SRAM, 512KX36, 3.8ns, CMOS, PQFP100 ZBT SRAM, 512KX36, 4.2ns, CMOS, PBGA119 ZBT SRAM, 1MX18, 3.8ns, CMOS, PBGA119 ZBT SRAM, 512KX36, 3.5ns, CMOS, PQFP100
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 QFP, QFP100,.63X.87 QFP, QFP100,.63X.87 QFP, QFP100,.63X.87 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 QFP, QFP100,.63X.87
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknow
Maximum access time 3.5 ns 3.8 ns 4.2 ns 4.2 ns 3.5 ns 3.8 ns 4.2 ns 3.8 ns 3.5 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PBGA-B119 R-PBGA-B119 R-PQFP-G100
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bi
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 18 36 18 18 18 36 36 18 36
Humidity sensitivity level 3 3 3 3 3 3 3 3 3
Number of terminals 119 119 119 100 100 100 119 119 100
word count 1048576 words 524288 words 1048576 words 1048576 words 1048576 words 524288 words 524288 words 1048576 words 524288 words
character code 1000000 512000 1000000 1000000 1000000 512000 512000 1000000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX18 512KX36 1MX18 1MX18 1MX18 512KX36 512KX36 1MX18 512KX36
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA QFP QFP QFP BGA BGA QFP
Encapsulate equivalent code BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 BGA119,7X17,50 BGA119,7X17,50 QFP100,.63X.87
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK FLATPACK FLATPACK GRID ARRAY GRID ARRAY FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260 260
power supply 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A
Minimum standby current 2.38 V 2.38 V 2.38 V 2.38 V 2.38 V 2.38 V 2.38 V 2.38 V 2.38 V
Maximum slew rate 0.32 mA 0.3 mA 0.28 mA 0.28 mA 0.32 mA 0.3 mA 0.28 mA 0.3 mA 0.32 mA
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL GULL WING GULL WING GULL WING BALL BALL GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 0.635 mm 0.635 mm 0.635 mm 1.27 mm 1.27 mm 0.635 mm
Terminal location BOTTOM BOTTOM BOTTOM QUAD QUAD QUAD BOTTOM BOTTOM QUAD
Maximum time at peak reflow temperature 40 40 40 40 40 40 40 40 40
Maker SAMSUNG SAMSUNG SAMSUNG - - SAMSUNG SAMSUNG SAMSUNG SAMSUNG

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号