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AS7C33128NTD18B

Description
3.3V 128Kx18 Pipelined SRAM with NTD
File Size422KB,19 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
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AS7C33128NTD18B Overview

3.3V 128Kx18 Pipelined SRAM with NTD

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Description 3.3V 128Kx18 Pipelined SRAM with NTD 3.3V 128Kx18 Pipelined SRAM with NTD 3.3V 128Kx18 Pipelined SRAM with NTD 3.3V 128Kx18 Pipelined SRAM with NTD 3.3V 128Kx18 Pipelined SRAM with NTD 3.3V 128Kx18 Pipelined SRAM with NTD 3.3V 128Kx18 Pipelined SRAM with NTD
Is it Rohs certified? - conform to conform to incompatible conform to conform to incompatible
Maker - ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation]
Parts packaging code - QFP QFP QFP QFP QFP QFP
package instruction - LQFP, LQFP, LQFP, LQFP, LQFP, LQFP,
Contacts - 100 100 100 100 100 100
Reach Compliance Code - unknow unknow unknow unknow unknow unknow
ECCN code - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time - 4 ns 4 ns 3.5 ns 3.5 ns 3 ns 4 ns
Other features - PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code - R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code - e3 e3 e0 e3 e3 e0
length - 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density - 2359296 bi 2359296 bi 2359296 bi 2359296 bi 2359296 bi 2359296 bi
Memory IC Type - ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width - 18 18 18 18 18 18
Number of functions - 1 1 1 1 1 1
Number of terminals - 100 100 100 100 100 100
word count - 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code - 128000 128000 128000 128000 128000 128000
Operating mode - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - 70 °C 85 °C 85 °C 70 °C 70 °C 70 °C
organize - 128KX18 128KX18 128KX18 128KX18 128KX18 128KX18
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - LQFP LQFP LQFP LQFP LQFP LQFP
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - 245 245 NOT SPECIFIED 245 245 NOT SPECIFIED
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) - 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) - 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - YES YES YES YES YES YES
technology - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface - Matte Tin (Sn) Matte Tin (Sn) TIN LEAD Matte Tin (Sn) Matte Tin (Sn) TIN LEAD
Terminal form - GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch - 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location - QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature - 30 30 NOT SPECIFIED 30 30 NOT SPECIFIED
width - 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
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