IC,LOGIC GATE,HEX INVERTER,HC-CMOS,DIP,16PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Renesas Electronics Corporation |
Reach Compliance Code | not_compliant |
JESD-30 code | R-PDIP-T16 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | INVERTER |
MaximumI(ol) | 0.004 A |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2/6 V |
Prop。Delay @ Nom-Sup | 26 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
5962-01-316-4436 | CD74HC4049E | CD74HC4050M | CD74HC4050E | CD74HC4049M | |
---|---|---|---|---|---|
Description | IC,LOGIC GATE,HEX INVERTER,HC-CMOS,DIP,16PIN,PLASTIC | INVERT GATE | NON-INVERT GATE | NON-INVERT GATE | INVERT GATE |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 code | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | INVERTER | INVERTER | BUFFER | BUFFER | INVERTER |
MaximumI(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
Number of terminals | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | SOP | DIP | SOP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 | SOP16,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
Prop。Delay @ Nom-Sup | 26 ns | 26 ns | 26 ns | 21 ns | 26 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | NO | NO | NO | NO | NO |
surface mount | NO | NO | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | - | Renesas Electronics Corporation | Renesas Electronics Corporation |
JESD-609 code | - | e0 | e0 | e0 | e0 |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
package instruction | - | - | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 |