CD74HC4050M datasheet, PDF - EEWORLD Datasheet

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CD74HC4050M: DescriptionNON-INVERT GATE; Categorylogic logic; File Size230KB，4 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD74HC4050M Overview

NON-INVERT GATE

CD74HC4050M Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	SOP, SOP16,.25
Reach Compliance Code	not_compliant
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.004 A
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	26 ns
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

CD74HC4050M Related Products

	CD74HC4050M	CD74HC4049E	CD74HC4050E	CD74HC4049M	5962-01-316-4436
Description	NON-INVERT GATE	INVERT GATE	NON-INVERT GATE	INVERT GATE	IC,LOGIC GATE,HEX INVERTER,HC-CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-PDSO-G16	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDIP-T16
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUFFER	INVERTER	BUFFER	INVERTER	INVERTER
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of terminals	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	DIP	SOP	DIP
Encapsulate equivalent code	SOP16,.25	DIP16,.3	DIP16,.3	SOP16,.25	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	26 ns	26 ns	21 ns	26 ns	26 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO
surface mount	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	MILITARY	MILITARY
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
package instruction	SOP, SOP16,.25	-	DIP, DIP16,.3	SOP, SOP16,.25	-
JESD-609 code	e0	e0	e0	e0	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Maker	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation

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