is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
R
TJC
is guaranteed by design while R
TJA
is determined by the user’s board design.
a. 53°C/W when mounted on
a 1 in
2
pad of 2 oz copper
b. 125°C/W when mounted on a
minimum pad of 2 oz copper
2. Pulse Test: Pulse Width < 300
P
s, Duty cycle < 2.0%.
3. Starting T
J
= 25 °C, L = 1 mH, I
AS
= 20 A, V
DD
= 27 V, V
GS
= 10 V
4. As an N-channel device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied
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https...
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