EEPROM, 32KX32, 150ns, Parallel, CMOS, PQMA68, MODULE-68
Parameter Name | Attribute value |
Maker | Force Technologies Ltd. |
package instruction | , |
Reach Compliance Code | compliant |
Maximum access time | 150 ns |
Other features | ALSO ORGANISED AS 128KX8 |
Spare memory width | 16 |
JESD-30 code | S-PQMA-G68 |
length | 24.7904 mm |
memory density | 1048576 bit |
Memory IC Type | EEPROM |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 32KX32 |
Package body material | PLASTIC/EPOXY |
Package shape | SQUARE |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Programming voltage | 5 V |
Maximum seat height | 5.334 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
width | 24.7904 mm |
Maximum write cycle time (tWC) | 10 ms |
FTE32KX32XHP-15I | FTE32KX32XHP-12C | FTE32KX32XHP-12M | FTE32KX32XHP-12I | FTE32KX32XHP-15C | FTE32KX32XHP-15M | |
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Description | EEPROM, 32KX32, 150ns, Parallel, CMOS, PQMA68, MODULE-68 | EEPROM, 32KX32, 120ns, Parallel, CMOS, PQMA68, MODULE-68 | EEPROM, 32KX32, 120ns, Parallel, CMOS, PQMA68, MODULE-68 | EEPROM, 32KX32, 120ns, Parallel, CMOS, PQMA68, MODULE-68 | EEPROM, 32KX32, 150ns, Parallel, CMOS, PQMA68, MODULE-68 | EEPROM, 32KX32, 150ns, Parallel, CMOS, PQMA68, MODULE-68 |
Maker | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. | Force Technologies Ltd. |
Reach Compliance Code | compliant | compliant | compliant | compliant | compli | compli |
Maximum access time | 150 ns | 120 ns | 120 ns | 120 ns | 150 ns | 150 ns |
Other features | ALSO ORGANISED AS 128KX8 | ALSO ORGANISED AS 128KX8 | ALSO ORGANISED AS 128KX8 | ALSO ORGANISED AS 128KX8 | ALSO ORGANISED AS 128KX8 | ALSO ORGANISED AS 128KX8 |
Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 |
JESD-30 code | S-PQMA-G68 | S-PQMA-G68 | S-PQMA-G68 | S-PQMA-G68 | S-PQMA-G68 | S-PQMA-G68 |
length | 24.7904 mm | 24.7904 mm | 24.7904 mm | 24.7904 mm | 24.7904 mm | 24.7904 mm |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 32 | 32 | 32 | 32 | 32 | 32 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 |
word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 125 °C | 85 °C | 70 °C | 125 °C |
Minimum operating temperature | -40 °C | - | -55 °C | -40 °C | - | -55 °C |
organize | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 | 32KX32 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Maximum seat height | 5.334 mm | 5.334 mm | 5.334 mm | 5.334 mm | 5.334 mm | 5.334 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
width | 24.7904 mm | 24.7904 mm | 24.7904 mm | 24.7904 mm | 24.7904 mm | 24.7904 mm |
Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |