Framer, PQFP144, ETQFP-144
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | CONEXANT |
| Parts packaging code | QFP |
| package instruction | LFQFP, QFP144,.87SQ,20 |
| Contacts | 144 |
| Reach Compliance Code | compliant |
| JESD-30 code | S-PQFP-G144 |
| JESD-609 code | e0 |
| length | 20 mm |
| Number of functions | 3 |
| Number of terminals | 144 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFQFP |
| Encapsulate equivalent code | QFP144,.87SQ,20 |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2.5,3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Nominal supply voltage | 2.5 V |
| surface mount | YES |
| Telecom integrated circuit types | FRAMER |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 20 mm |
| CX28343 | CX28346 | CX28348 | CX28342 | |
|---|---|---|---|---|
| Description | Framer, PQFP144, ETQFP-144 | Framer, PBGA318, 27 X 27 MM, PLASTIC, BGA-318 | Framer, PBGA318, 27 X 27 MM, PLASTIC, BGA-318 | Framer, PQFP144, ETQFP-144 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | CONEXANT | CONEXANT | CONEXANT | CONEXANT |
| Parts packaging code | QFP | BGA | BGA | QFP |
| package instruction | LFQFP, QFP144,.87SQ,20 | BGA, BGA318,20X20,50 | BGA, BGA318,20X20,50 | LFQFP, QFP144,.87SQ,20 |
| Contacts | 144 | 318 | 318 | 144 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| JESD-30 code | S-PQFP-G144 | S-PBGA-B318 | S-PBGA-B318 | S-PQFP-G144 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 20 mm | 27 mm | 27 mm | 20 mm |
| Number of functions | 3 | 6 | 8 | 2 |
| Number of terminals | 144 | 318 | 318 | 144 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFQFP | BGA | BGA | LFQFP |
| Encapsulate equivalent code | QFP144,.87SQ,20 | BGA318,20X20,50 | BGA318,20X20,50 | QFP144,.87SQ,20 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY | GRID ARRAY | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 2.44 mm | 2.44 mm | 1.6 mm |
| Nominal supply voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| surface mount | YES | YES | YES | YES |
| Telecom integrated circuit types | FRAMER | FRAMER | FRAMER | FRAMER |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | BALL | BALL | GULL WING |
| Terminal pitch | 0.5 mm | 1.27 mm | 1.27 mm | 0.5 mm |
| Terminal location | QUAD | BOTTOM | BOTTOM | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 20 mm | 27 mm | 27 mm | 20 mm |
| Is it lead-free? | Contains lead | Contains lead | - | Contains lead |
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