CX28348 datasheet, PDF - EEWORLD Datasheet

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CX28348: DescriptionFramer, PBGA318, 27 X 27 MM, PLASTIC, BGA-318; CategoryWireless rf/communication Telecom circuit; File Size2MB，172 Pages; ManufacturerCONEXANT; Websitehttp://www.conexant.com/

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CX28348 Overview

Framer, PBGA318, 27 X 27 MM, PLASTIC, BGA-318

CX28348 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	CONEXANT
Parts packaging code	BGA
package instruction	BGA, BGA318,20X20,50
Contacts	318
Reach Compliance Code	compliant
JESD-30 code	S-PBGA-B318
JESD-609 code	e0
length	27 mm
Number of functions	8
Number of terminals	318
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA318,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5,3.3 V
Certification status	Not Qualified
Maximum seat height	2.44 mm
Nominal supply voltage	2.5 V
surface mount	YES
Telecom integrated circuit types	FRAMER
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm

CX28348 Related Products

	CX28348	CX28346	CX28343	CX28342
Description	Framer, PBGA318, 27 X 27 MM, PLASTIC, BGA-318	Framer, PBGA318, 27 X 27 MM, PLASTIC, BGA-318	Framer, PQFP144, ETQFP-144	Framer, PQFP144, ETQFP-144
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	CONEXANT	CONEXANT	CONEXANT	CONEXANT
Parts packaging code	BGA	BGA	QFP	QFP
package instruction	BGA, BGA318,20X20,50	BGA, BGA318,20X20,50	LFQFP, QFP144,.87SQ,20	LFQFP, QFP144,.87SQ,20
Contacts	318	318	144	144
Reach Compliance Code	compliant	compliant	compliant	compliant
JESD-30 code	S-PBGA-B318	S-PBGA-B318	S-PQFP-G144	S-PQFP-G144
JESD-609 code	e0	e0	e0	e0
length	27 mm	27 mm	20 mm	20 mm
Number of functions	8	6	3	2
Number of terminals	318	318	144	144
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	LFQFP	LFQFP
Encapsulate equivalent code	BGA318,20X20,50	BGA318,20X20,50	QFP144,.87SQ,20	QFP144,.87SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.44 mm	2.44 mm	1.6 mm	1.6 mm
Nominal supply voltage	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES
Telecom integrated circuit types	FRAMER	FRAMER	FRAMER	FRAMER
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	20 mm	20 mm
Is it lead-free?	-	Contains lead	Contains lead	Contains lead

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