Microcontroller, 16-Bit, MROM, 16MHz, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NEC Electronics |
| Parts packaging code | DIP |
| package instruction | 0.750 INCH, SHRINK, PLASTIC, DIP-64 |
| Contacts | 64 |
| Reach Compliance Code | compliant |
| Has ADC | YES |
| Address bus width | |
| bit size | 16 |
| maximum clock frequency | 8 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | R-PDIP-T64 |
| JESD-609 code | e0 |
| Number of I/O lines | 52 |
| Number of terminals | 64 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| ROM programmability | MROM |
| Maximum seat height | 5.08 mm |
| speed | 16 MHz |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.778 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 19.05 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| UPD78362ACW-XXX | UPD78361ACW-XXX | |
|---|---|---|
| Description | Microcontroller, 16-Bit, MROM, 16MHz, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64 | Microcontroller, 16-Bit, MROM, 16MHz, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | NEC Electronics | NEC Electronics |
| Parts packaging code | DIP | DIP |
| package instruction | 0.750 INCH, SHRINK, PLASTIC, DIP-64 | SDIP, |
| Contacts | 64 | 64 |
| Reach Compliance Code | compliant | compliant |
| Has ADC | YES | YES |
| bit size | 16 | 16 |
| maximum clock frequency | 8 MHz | 8 MHz |
| DAC channel | NO | NO |
| DMA channel | NO | NO |
| External data bus width | 8 | 8 |
| JESD-30 code | R-PDIP-T64 | R-PDIP-T64 |
| JESD-609 code | e0 | e0 |
| Number of I/O lines | 52 | 52 |
| Number of terminals | 64 | 64 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| PWM channel | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SDIP | SDIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified |
| ROM programmability | MROM | MROM |
| Maximum seat height | 5.08 mm | 5.08 mm |
| speed | 16 MHz | 16 MHz |
| Maximum supply voltage | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | NO | NO |
| technology | MOS | MOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.778 mm | 1.778 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 19.05 mm | 19.05 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER |
Special Edition for Assessment Centres
Microcontroller MCU
Domestic Chip Exchange
Test/Measurement
Domestic Chip Exchange
MicroPython Open Source section
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD