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HD6432214XXXTE: DescriptionMicrocontroller, 16-Bit, MROM, 16MHz, CMOS, PQFP100, PLASTIC, TQFP-100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，865 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HD6432214XXXTE Overview

Microcontroller, 16-Bit, MROM, 16MHz, CMOS, PQFP100, PLASTIC, TQFP-100

HD6432214XXXTE Parametric

Parameter Name	Attribute value
Maker	Hitachi （Renesas ）
Parts packaging code	QFP
package instruction	TFQFP,
Contacts	100
Reach Compliance Code	unknown
Has ADC	NO
Address bus width	24
bit size	16
maximum clock frequency	16 MHz
DAC channel	YES
DMA channel	YES
External data bus width	16
JESD-30 code	S-PQFP-G100
length	14 mm
Number of I/O lines	81
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	1.2 mm
speed	16 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Hitachi 16-Bit Single-Chip Microcomputer

H8S/2214, H8S/2214 F-ZTAT™

Hardware Manual

ADE-602-213A

Rev. 2.0

7/26/01

Hitachi Ltd.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or

use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that

demands especially high quality and reliability or where its failure or malfunction may directly

threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear

power, combustion control, transportation, traffic, safety equipment or medical equipment for

life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,

consider normally foreseeable failure rates or failure modes in semiconductor devices and

employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi

product does not cause bodily injury, fire or other consequential damage due to operation of

the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

Preface

This LSI is a single-chip microcomputer made up of the H8S/2000 CPU with an internal 32-bit

architecture as its core, and the peripheral functions required to configure a system.

This LSI is equipped with ROM, RAM, a bus controller, data transfer controller (DTC), a DMA

controller (DMAC), two types of timers, a serial communication interface (SCI), a D/A converter,

an A/D converter, and I/O ports as on-chip supporting modules. This LSI is suitable for use as an

embedded processor for high-level control systems. Its on-chip ROM are flash memory (F-

ZTAT™*) and mask ROM that provides flexibility as it can be reprogrammed in no time to cope

with all situations from the early stages of mass production to full-scale mass production. This is

particularly applicable to application devices with specifications that will most probably change.

Note: * F-ZTAT™ is a trademark of Hitachi, Ltd.

Target Users: This manual was written for users who will be using the H8S/2214, H8S/2214F-

ZTAT™ in the design of application systems. Members of this audience are

expected to understand the fundamentals of electrical circuits, logical circuits, and

microcomputers.

Objective:

This manual was written to explain the hardware functions and electrical

characteristics of the H8S/2214, H8S/2214F-ZTAT™ to the above audience. Refer

to the H8S/2600 Series, H8S/2000 Series Programming Manual for a detailed

description of the instruction set.

Notes on reading this manual:

•

In order to understand the overall functions of the chip

Read the manual according to the contents. This manual can be roughly categorized into parts

on the CPU, system control functions, peripheral functions and electrical characteristics.

•

In order to understand the details of the CPU's functions

Read the H8S/2600 Series, H8S/2000 Series Programming Manual.

•

In order to understand the details of a register when its name is known

The addresses, bits, and initial values of the registers are summarized in Appendix B, Internal

I/O Registers.

Example:

Bit order:

The MSB is on the left and the LSB is on the right.

Related Manuals:

The latest versions of all related manuals are available from our web site.

Please ensure you have the latest versions of all documents you require.

http://www.hitachi.co.jp/Sicd/English/Products/micome.htm

HD6432214XXXTE Related Products

	HD6432214XXXTE	HD64F2214TE16	HD64F2214TF16	HD64F2214BP	64F2214BP	64F2214TE16	HD6432214XXXTF	HD6432214XXXBP
Description	Microcontroller, 16-Bit, MROM, 16MHz, CMOS, PQFP100, PLASTIC, TQFP-100	Microcontroller, 16-Bit, FLASH, H8S/2000 CPU, 16MHz, CMOS, PQFP100, PLASTIC, TQFP-100	Microcontroller, 16-Bit, FLASH, H8S/2000 CPU, 16MHz, CMOS, PQFP100, PLASTIC, TQFP-100	Microcontroller, 16-Bit, FLASH, H8S/2000 CPU, 16MHz, CMOS, PBGA112, PLASTIC, TFBGA-112	Microcontroller,	Microcontroller,	Microcontroller, 16-Bit, MROM, 16MHz, CMOS, PQFP100, PLASTIC, TQFP-100	Microcontroller, 16-Bit, MROM, 16MHz, CMOS, PBGA112, PLASTIC, TFBGA-112
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
package instruction	TFQFP,	TFQFP, TQFP100,.63SQ	TFQFP, TQFP100,.55SQ,16	TFBGA, BGA112,11X11,32	,	,	TFQFP,	TFBGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Parts packaging code	QFP	QFP	QFP	BGA	-	-	QFP	BGA
Contacts	100	100	100	112	-	-	100	112
Has ADC	NO	NO	NO	NO	-	-	NO	NO
Address bus width	24	24	24	24	-	-	24	24
bit size	16	16	16	16	-	-	16	16
maximum clock frequency	16 MHz	16 MHz	16 MHz	16 MHz	-	-	16 MHz	16 MHz
DAC channel	YES	YES	YES	YES	-	-	YES	YES
DMA channel	YES	YES	YES	YES	-	-	YES	YES
External data bus width	16	16	16	16	-	-	16	16
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PBGA-B112	-	-	S-PQFP-G100	S-PBGA-B112
length	14 mm	14 mm	12 mm	10 mm	-	-	12 mm	10 mm
Number of I/O lines	81	81	81	81	-	-	81	81
Number of terminals	100	100	100	112	-	-	100	112
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	-	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	-	-	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFQFP	TFQFP	TFQFP	TFBGA	-	-	TFQFP	TFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	-	-	SQUARE	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	-	FLATPACK, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified
ROM programmability	MROM	FLASH	FLASH	FLASH	-	-	MROM	MROM
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-	-	1.2 mm	1.2 mm
speed	16 MHz	16 MHz	16 MHz	16 MHz	-	-	16 MHz	16 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	-	-	3.6 V	3.6 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	-	-	2.7 V	2.7 V
Nominal supply voltage	3 V	3 V	3 V	3 V	-	-	3 V	3 V
surface mount	YES	YES	YES	YES	-	-	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	-	-	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	-	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	BALL	-	-	GULL WING	BALL
Terminal pitch	0.5 mm	0.5 mm	0.4 mm	0.8 mm	-	-	0.4 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD	BOTTOM	-	-	QUAD	BOTTOM
width	14 mm	14 mm	12 mm	10 mm	-	-	12 mm	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-	-	MICROCONTROLLER	MICROCONTROLLER

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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