5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Standard & High Temperature Open Frame DIP Sockets
Features:
• Multiple finger contact on all sockets
assures maximum reliability.
• Tapered entry for ease of insertion.
• Closed bottom sleeve for 100% anti-
wicking of solder.
• To fit .100” (2.54 mm) pitch.
• Easily customized to fit your application.
• For surface mount applications use HLS
only.
Standard Sockets
LS -
Insulator Material:
Glass Filled Thermoplastic Polyester (P.B.T.)
U.L. Rated 94V-O, -60˚C to 140˚C (-76˚F to 284˚F)
How To Order
LS
Body Type
Standard Open Frame DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
9 - .900" (22.86 mm)
3
16
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
63% Tin, 37% Lead
Number of Pins
(8 to 64)
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
High Temperature Sockets
HLS -
Insulator Material:
High Temp. Glass Filled Thermoplastic
U.L. Rated 94V-O, -60˚C to 260˚C (-76˚F to 500˚F)
How To Order
HLS
Body Type
High Temp. Open Frame DIP
DIP Spacing
3 - .300" (7.62 mm)
4 - .400" (10.16 mm)
6 - .600" (15.24 mm)
9 - .900" (22.86 mm)
3
16
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types.
Number of Pins
(8 to 64)
Page 82
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Open Frame
Dual In-Line Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Standard & High Temperature Open Frame DIP Sockets
Terminal Information
Low Profile Solder Tail
Type -01
Low Profile Solder Tail
Type -29
Low Profile Solder Tail
Type -30
A
C
B
.165
(4.19)
.050*
(1.27)
.125
(3.18)
.020 Dia.
(.51)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.165
(4.19)
.275
(6.99)
Dimensional Information
# of
Pins
8
14
16
18
20
22
24
28
22
24
24
28
32
40
48*
64*
A
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.400
(10.16)
.400
(10.16)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.900
(22.86)
B
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.500
(12.70)
.500
(12.70)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
1.000
(25.40)
C
.400
(10.16)
.700
(17.78)
.800
(20.32)
.900
(22.86)
1.000
(25.40)
1.100
(27.94)
1.200
(30.48)
1.400
(35.56)
1.100
(27.54)
1.200
(30.48)
1.200
(30.48)
1.400
(35.56)
1.600
(40.64)
2.000
(50.80)
2.400
(60.96)
3.200
(81.28)
DIP
Low Profile Solder Tail
Type -51
Super Low Profile
Type -04
Super Low Profile
Type -38
.130
(3.30)
.110
(2.79)
.020 Dia.
(.51)
.028 Dia.
(.71)
.120
(3.05)
.110
(2.79)
.028 Dia.
(.71)
.120
(3.05)
.140
(3.56)
Ultra Low Profile
Type -49
Ultra Low Profile
Type -299
Surface Mount
Type -237
HLS Only
.095
(2.41)
.095
(2.41)
.028 Dia.
(.71)
.025 Dia.
(.64)
.083
(2.11)
.082
(2.08)
.155
(3.94)
.052 Dia.
(1.32)
Quick turn delivery available on standard terminal types.
Additional terminal types available.
See terminal section for detailed terminal information.
*Socket body thickness is .100/(2.54)
for 48 and 64 positions
Solder Preform Terminals
Available on HLS Body Type
Type -150
.072 Dia.
(1.83)
Type -151
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.165
.165
(4.19)
(4.19)
Solder
Preform
.125
.125
(3.18)
(3.18)
.020 Dia.
(.51)
.130
(3.30)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.020 Dia.
(.51)
See page 81 for complete details.
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 83
Search by:
Keyword
Part Number
LS324-48TG
search
1. Enter any word or words that describe what your are looking for.
2. Select Search by: Keyword.
3. Click the SEARCH button.
You will be presented with a list of products that match your criteria. Click on the product name to get technical specs and access product-
specific features such as Data Sheets in PDF format, our Build-A-Part online product configurator, Related Documents and more.
For a quick product description and link to the product family page:
1. Enter an exact part number (not case sensitive, but dashes must be included in the proper place, ex. MGSB357-636GG or 1KS068-
85TG).
2. Select Search by: Part Number.
3. Click the SEARCH button.
To find a local Distributor or Representative, please click on
Global Sales Directory.
4-digit part numbers for custom products and terminal part numbers are not included in the database. Please contact
customer service
with your
name and company contact information for product information and CAD drawings for any products not listed.
For detailed product information (data sheet, etc.), click on the Product Family link and use the description below to select the product-specific
category from the next screen. To check if a CAD Drawing is available on-line, use the CAD Drawing Lookup link in the bar at the bottom of the
[font=Tahoma, Helvetica, SimSun, sans-serif][size=14px]Purpose:[/size][/font] [font=Tahoma, Helvetica, SimSun, sans-serif][size=14px]1. Monitor the internal register data of nRF24L01 chip through PC s...
Air quality sensors are not new. In fact, we all have one on our face. Unfortunately, our noses are sometimes unreliable, failing to detect odorless harmful gases or when a fire breaks out nearby whil...
[i=s]This post was last edited by 怀穿少年梦 on 2021-6-28 19:18[/i]This is my first time to use ESP32. I just heard that ESP32 is a SOC chip with many peripherals integrated in it, which is a bit like a si...
The employment winter has arrived. These days, official media and gossip are always full of public opinion. From the first of the six stability guarantees of the central government's economic work in ...
The course content is gradually developed from the basic physics and the basic operation of capacitor structure, and then discusses the structure and operation of MOSFET and NVSM, allowing students to...
1. The microcomputer relay protection tester can only be used to test microcomputer relay protection devices and cannot be used to test other equipment. 2. To prevent static electricity from being in...[Details]
Now, European manufacturers represented by Mercedes-Benz, BMW, Audi-Volkswagen, etc. seem to have occupied the current mainstream technology route. Even Korean cars have begun to show their own tec...[Details]
Smart buildings have been developing rapidly in China for more than a decade, with new technologies and new products emerging one after another. All aspects of smart buildings have been inte...[Details]
When designing an analog-to-digital converter system, the initial design approach you might take is to first investigate the accuracy required and then use an ADC that provides a comparable accurac...[Details]
The battle for wireless charging chips is intensifying. As more and more OEMs begin to introduce wireless charging functions, the market demand for related chips is also rising rapidly, which not onl...[Details]
On the Pain Points in the Development of Educational Digitalization - Let Technology and Educational Scenarios "Become One" Let technological innovation become the "accelerator" of education digital...[Details]
Recently, Samsung's flash memory chip project in Xi'an has made an important breakthrough, and the second phase of the second phase of the project with an investment of US$8 billion has officially st...[Details]
On December 24, at the North Phase III Wharf of Taicang Port, China, as the last blade was slowly hoisted onto the deck of the "Yellow River", the first shipment of Goldwind's Biala large-scale...[Details]
Open source has gradually become a new generation of software development model, which can effectively promote rapid product iteration. However, the risk of open source is relatively complex, includi...[Details]
Today, a post on the Korean community website Clien talked about Apple preparing to launch a hybrid console similar to the Switch. According to reports, Qualcomm has also been developing similar prod...[Details]
Each generation of high-end processors, FPGAs, and ASICs places an increased burden on power supplies with heavier loads, but system designers rarely allocate additional precious system board space t...[Details]
ROHM, a world-renowned semiconductor manufacturer (headquartered in Kyoto, Japan), has developed the "BUxxJA3DG-C Series (BU12JA3DG-C, BU15JA3DG-C, BU18JA3DG-C, BU25JA3DG-C, BU30JA3DG-C, BU33JA3DG-...[Details]
According to a leaked support document discovered by 9to5Mac, Apple may be planning to release a dual-port 35W USB-C charger in the near future. The support document only appeared on Apple's we...[Details]
Compared with the main memory capacity, the cache capacity is very small. The information it stores is only a subset of the main memory information, and the information exchange between the cache and ...[Details]
With the continuous integration of many technological breakthroughs and new streaming services, and the growing prosperity of the smart home and smart speaker markets, consumers' demand for audio i...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
