H5TC4G43MFR datasheet, PDF - EEWORLD Datasheet

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H5TC4G43MFR: Description4Gb DDR3L SDRAM; File Size429KB，34 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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H5TC4G43MFR Overview

4Gb DDR3L SDRAM

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4Gb DDR3L SDRAM

Lead-Free&Halogen-Free

(RoHS Compliant)

H5TC4G43MFR-xxA

H5TC4G83MFR-xxA

H5TC4G63MFR-xxA

* SK hyix Semiconductor reserves the right to change products or specifications without

Rev. 1.0 / Nov. 2012

H5TC4G43MFR Related Products

	H5TC4G43MFR	H5TC4G43MFR-G7A	H5TC4G43MFR-H9A	H5TC4G43MFR-PBA	H5TC4G63MFR-G7A	H5TC4G63MFR-H9A	H5TC4G63MFR-PBA	H5TC4G83MFR-G7A	H5TC4G83MFR-H9A	H5TC4G83MFR-PBA
Description	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM	4Gb DDR3L SDRAM
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	-	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	-	TFBGA, BGA78,9X13,32	TFBGA, BGA78,9X13,32	TFBGA, BGA78,9X13,32	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA, BGA78,9X13,32	TFBGA, BGA78,9X13,32	TFBGA, BGA78,9X13,32
Contacts	-	78	78	78	96	96	96	78	78	78
Reach Compliance Code	-	compli	compli	compli	compli	compli	compli	compli	compli	compli
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	-	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
Other features	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	-	533 MHz	667 MHz	800 MHz	533 MHz	667 MHz	800 MHz	533 MHz	667 MHz	800 MHz
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
interleaved burst length	-	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
JESD-30 code	-	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78
JESD-609 code	-	e1	e1	e1	e1	e1	e1	e1	e1	e1
length	-	11 mm	11 mm	11 mm	13 mm	13 mm	13 mm	11 mm	11 mm	11 mm
memory density	-	4294967296 bi	4294967296 bi	4294967296 bi	4294967296 bi	4294967296 bi	4294967296 bi	4294967296 bi	4294967296 bi	4294967296 bi
Memory IC Type	-	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	-	4	4	4	16	16	16	8	8	8
Number of functions	-	1	1	1	1	1	1	1	1	1
Number of ports	-	1	1	1	1	1	1	1	1	1
Number of terminals	-	78	78	78	96	96	96	78	78	78
word count	-	1073741824 words	1073741824 words	1073741824 words	268435456 words	268435456 words	268435456 words	536870912 words	536870912 words	536870912 words
character code	-	1000000000	1000000000	1000000000	256000000	256000000	256000000	512000000	512000000	512000000
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
organize	-	1GX4	1GX4	1GX4	256MX16	256MX16	256MX16	512MX8	512MX8	512MX8
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	-	BGA78,9X13,32	BGA78,9X13,32	BGA78,9X13,32	BGA96,9X16,32	BGA96,9X16,32	BGA96,9X16,32	BGA78,9X13,32	BGA78,9X13,32	BGA78,9X13,32
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	-	260	260	260	260	260	260	260	260	260
power supply	-	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	-	8192	8192	8192	8192	8192	8192	8192	8192	8192
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	-	YES	YES	YES	YES	YES	YES	YES	YES	YES
Continuous burst length	-	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
Maximum standby current	-	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A
Maximum slew rate	-	0.14 mA	0.16 mA	0.165 mA	-	-	-	0.145 mA	0.165 mA	0.17 mA
Maximum supply voltage (Vsup)	-	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V
Minimum supply voltage (Vsup)	-	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V
Nominal supply voltage (Vsup)	-	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
surface mount	-	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	-	20	20	20	20	20	20	20	20	20
width	-	9.4 mm	9.4 mm	9.4 mm	9.4 mm	9.4 mm	9.4 mm	9.4 mm	9.4 mm	9.4 mm

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