LXP2175NC datasheet, PDF - EEWORLD Datasheet

LXP2175NC: DescriptionElastic Buffer, CMOS, PDIP16,; CategoryWireless rf/communication Telecom circuit; File Size237KB，7 Pages; ManufacturerLevel One

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LXP2175NC Overview

Elastic Buffer, CMOS, PDIP16,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Level One
Objectid	1422419141
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
compound_id	11493897
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Number of functions	1
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	ELASTIC BUFFER
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	LXP2175NC	LXP2175NE	LXP2175SC	LXP2175SE
Description	Elastic Buffer, CMOS, PDIP16,	Elastic Buffer, CMOS, PDIP16,	Elastic Buffer, CMOS, PDSO16, PLASTIC, SOP-16	Elastic Buffer, CMOS, PDSO16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Level One	Level One	Level One	Level One
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.3	SOP, SOP16,.4
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0
Number of functions	1	1	1	1
Number of terminals	16	16	16	16
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	SOP16,.3	SOP16,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	ELASTIC BUFFER	ELASTIC BUFFER	ELASTIC BUFFER	ELASTIC BUFFER
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	-	1	1	1

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