Elastic Buffer, CMOS, PDSO16, PLASTIC, SOP-16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Level One |
Parts packaging code | SOIC |
package instruction | SOP, SOP16,.3 |
Contacts | 16 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDSO-G16 |
JESD-609 code | e0 |
length | 10.3 mm |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP16,.3 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 2.65 mm |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | ELASTIC BUFFER |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 7.5 mm |
Base Number Matches | 1 |
LXP2175SC | LXP2175NE | LXP2175SE | LXP2175NC | |
---|---|---|---|---|
Description | Elastic Buffer, CMOS, PDSO16, PLASTIC, SOP-16 | Elastic Buffer, CMOS, PDIP16, | Elastic Buffer, CMOS, PDSO16, | Elastic Buffer, CMOS, PDIP16, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Level One | Level One | Level One | Level One |
package instruction | SOP, SOP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.4 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
JESD-30 code | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 | 16 |
Maximum operating temperature | 70 °C | 85 °C | 85 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | SOP | DIP |
Encapsulate equivalent code | SOP16,.3 | DIP16,.3 | SOP16,.4 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Telecom integrated circuit types | ELASTIC BUFFER | ELASTIC BUFFER | ELASTIC BUFFER | ELASTIC BUFFER |
Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | - |