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MM74HC20MX

Description
HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDSO14, PLASTIC, SO-14
Categorylogic    logic   
File Size82KB,3 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

MM74HC20MX Overview

HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDSO14, PLASTIC, SO-14

MM74HC20MX Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeSOIC
package instructionSOP,
Contacts14
Reach Compliance Codeunknown
seriesHC/UH
JESD-30 codeR-PDSO-G14
length8.65 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
Number of functions2
Number of entries4
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
propagation delay (tpd)23 ns
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width3.9 mm

MM74HC20MX Related Products

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Description HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDSO14, PLASTIC, SO-14 HC/UH SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14 IC HC/UH SERIES, DUAL 4-INPUT NAND GATE, PDSO14, PLASTIC, SO-14, Gate HC/UH SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code SOIC DFP SOIC QLCC
package instruction SOP, DFP, FL14,.3 SOP, SOP14,.25 QCCN, LCC20,.35SQ
Contacts 14 14 14 20
Reach Compliance Code unknown unknown unknown unknow
series HC/UH HC/UH HC/UH HC/UH
JESD-30 code R-PDSO-G14 R-GDFP-F14 R-PDSO-G14 S-CQCC-N20
length 8.65 mm 9.614 mm 8.65 mm 8.89 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE
Number of functions 2 2 2 2
Number of entries 4 4 4 4
Number of terminals 14 14 14 20
Maximum operating temperature 85 °C 125 °C 85 °C 125 °C
Minimum operating temperature -40 °C -55 °C -40 °C -55 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
encapsulated code SOP DFP SOP QCCN
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE FLATPACK SMALL OUTLINE CHIP CARRIER
propagation delay (tpd) 23 ns 27 ns 23 ns 27 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 2.032 mm 1.75 mm 1.905 mm
Maximum supply voltage (Vsup) 6 V 6 V 6 V 6 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY INDUSTRIAL MILITARY
Terminal form GULL WING FLAT GULL WING NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL QUAD
width 3.9 mm 6.35 mm 3.9 mm 8.89 mm
Is it lead-free? - Contains lead Contains lead Contains lead
Is it Rohs certified? - incompatible incompatible incompatible
JESD-609 code - e0 e0 e0
Encapsulate equivalent code - FL14,.3 SOP14,.25 LCC20,.35SQ
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 2/6 V 2/6 V 2/6 V
Schmitt trigger - NO NO NO
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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