GS8342D09E-400 datasheet, PDF - EEWORLD Datasheet

GS8342D09E-400: DescriptionStandard SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, BGA-165; Categorystorage storage; File Size997KB，35 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

Download Datasheet Parametric View All

GS8342D09E-400 Overview

Standard SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, BGA-165

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Objectid	2031979325
Parts packaging code	BGA
package instruction	BGA,
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
compound_id	6571020
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
length	17 mm
memory density	37748736 bit
Memory IC Type	STANDARD SRAM
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of terminals	165
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX9
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm

Greenhouse automatic spraying system ---- H743 water lamp: [color=#333333][font=微软雅黑, 微软雅黑, "][size=14px]I can finally start studying H743. I have had it for more than three months. I can't let it continue to gather dust. Let's start tonight. [/size][/font][/...; star_66666 stm32/stm8

Design of wireless serial port hub using ARM microprocessor and ZigBee module: 1. Introduction　　With the continuous progress of science and technology in the 21st century, wireless and mobile communications have developed rapidly. New concepts and products such as convenient and...; 火辣西米秀 RF/Wirelessly

Hitachi has developed a high thermal conductivity epoxy resin: Hitachi Ltd. has recently developed a new epoxy resin with a thermal conductivity of up to 7W/m·K, which is close to the level of ceramic materials. At the "Nikkei Nanotech Business Fair" held at the ...; fighting Analog electronics

EEWORLD Q&A list starts anew!: [size=4]Notice: From the release of this announcement, the old Q&A list system will be invalidated and the rules of this post will be adopted. These rules will be implemented immediately and will be i...; okhxyyo Suggestions & Announcements

How to allocate storage space for DSP: [size=4]Do not use DSP/BIOS to allocate space for the destination address of the EDMA channel of VPort. You can use the malloc function to place malloc on the SDRAM expanded by DM642. This can be achi...; fish001 DSP and ARM Processors

[TI recommended course] #Live replay: TI mmWave millimeter wave radar application in automobiles#: //training.eeworld.com.cn/TI/show/course/5657...; 孟珺 TI Technology Forum

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components