Hitachi has developed a high thermal conductivity epoxy resin

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Hitachi has developed a high thermal conductivity epoxy resin [Copy link]

Hitachi Ltd. has recently developed a new epoxy resin with a thermal conductivity of up to 7W/m·K, which is close to the level of ceramic materials. At the "Nikkei Nanotech Business Fair" held at the Tokyo BigSight International Convention and Exhibition Center, a rigid baseboard using this resin material was exhibited. Compared with previous epoxy resins, its thermal conductivity is more than 5 times, and by adjusting the amount of filler added, it is even possible to achieve a thermal conductivity of more than 10W/m·K. Experts from the China Epoxy Resin Industry Association said that this product is mainly aimed at insulating materials and power semiconductors
for printed circuit boards equipped with hybrid vehicle power modules. Such modules frequently switch on and off as the car's accelerator pedal moves. Therefore, in order to maintain a high power conversion efficiency, heat must be dissipated quickly. In the past, the power modules of hybrid vehicles used a large amount of colored ceramic materials to improve heat dissipation. Using the material developed this time will make the material cost cheaper than ceramic materials, so the cost of the power module can be reduced. This "can drive the price of hybrid vehicles down continuously."

In order to improve thermal conductivity, the epoxy resin developed this time has molecules arranged regularly. Mesogen (liquid crystal original) is used in the molecules. Each molecule adopts a polymer structure that is chained at 4nm intervals, and heat is conducted along this molecular chain.

Semiconductor packaging materials and other fields.