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IS61NLP51236B-200B2LA3

Description
Standard SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, LEAD FREE, PLASTIC, MS-028, BGA-119
Categorystorage    storage   
File Size2MB,39 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric View All

IS61NLP51236B-200B2LA3 Overview

Standard SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, LEAD FREE, PLASTIC, MS-028, BGA-119

IS61NLP51236B-200B2LA3 Parametric

Parameter NameAttribute value
MakerIntegrated Silicon Solution ( ISSI )
package instructionBGA,
Reach Compliance Codeunknown
Maximum access time3 ns
JESD-30 codeR-PBGA-B119
length22 mm
memory density18874368 bit
Memory IC TypeSTANDARD SRAM
memory width36
Number of functions1
Number of terminals119
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize512KX36
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Maximum seat height3.5 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width14 mm
IS61NLP51236(32)B/IS61NVP51236(32)B/IS61NVVP51236(32)B
IS61NLP102418B/IS61NVP102418B/IS61NVVP102418B
512K x36 and 1024K x18 18Mb, PIPELINE 'NO WAIT' STATE BUS
SYNCHRONOUS SRAM
FEBRUARY 2014
ADVANCED INFORMATION
FEATURES
100 percent bus utilization
No wait cycles between Read and Write
Internal self-timed write cycle
Individual Byte Write Control
Single R/W (Read/Write) control pin
Clock controlled, registered address, data and
control
Interleaved or linear burst sequence control
using MODE input
Three chip enables for simple depth
expansion and address pipelining
Power Down mode
Common data inputs and data outputs
/CKE pin to enable clock and suspend
operation
JEDEC 100-pin QFP, 165-ball BGA and 119-
ball BGA packages
Power supply:
NLP: V
DD
3.3V (± 5%), V
DDQ
3.3V/2.5V (± 5%)
NVP: V
DD
2.5V (± 5%), V
DDQ
2.5V (± 5%)
NVVP: V
DD
1.8V (± 5%), V
DDQ
1.8V (± 5%)
JTAG Boundary Scan for BGA packages
Commercial, Industrial and Automotive (x36)
temperature support
Lead-free available
For leaded option, please contact ISSI.
DESCRIPTION
The 18Meg product family features high-speed,
low-power synchronous static RAMs designed to
provide a burstable, high-performance, 'no wait'
state, device for networking and communications
applications. They are organized as 512K words
by 36 bits and 1024K words by 18 bits, fabricated
with
ISSI's
advanced CMOS technology.
Incorporating a 'no wait' state feature, wait cycles
are eliminated when the bus switches from read
to write, or write to read. This device integrates a
2-bit burst counter, high-speed SRAM core, and
high-drive capability outputs into a single
monolithic circuit.
All synchronous inputs pass through registers are
controlled by a positive-edge-triggered single
clock input. Operations may be suspended and all
synchronous inputs ignored when Clock Enable,
/CKE is HIGH. In this state the internal device will
hold their previous values.
All Read, Write and Deselect cycles are initiated
by the ADV input. When the ADV is HIGH the
internal burst counter is incremented. New
external addresses can be loaded when ADV is
LOW.
Write cycles are internally self-timed and are
initiated by the rising edge of the clock inputs and
when /WE is LOW. Separate byte enables allow
individual bytes to be written.
A burst mode pin (MODE) defines the order of the
burst sequence. When tied HIGH, the interleaved
burst sequence is selected. When tied LOW, the
linear burst sequence is selected.
FAST ACCESS TIME
Symbol
tKQ
tKC
Parameter
Clock Access Time
Cycle time
Frequency
-250
2.6
4
250
-200
3.0
5
200
Units
ns
ns
MHz
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at
any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein.
Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders
for products.
Integrated Silicon Solution, Inc.- www.issi.com
Rev. 00A
2/13/2014
1

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