Standard SRAM, 64KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48
Parameter Name | Attribute value |
Maker | SK Hynix |
Parts packaging code | BGA |
package instruction | VFBGA, |
Contacts | 48 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 85 ns |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e1 |
length | 6.3 mm |
memory density | 1048576 bit |
Memory IC Type | STANDARD SRAM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 0.95 mm |
Maximum supply voltage (Vsup) | 3.3 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
width | 6.2 mm |
HY62UF16101LLM-85 | HY62UF16101LLM-10 | HY62UF16101LLM-I-85 | HY62UF16101LLM-12 | HY62UF16101LLM-I-12 | HY62UF16101LLM-I-10 | |
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Description | Standard SRAM, 64KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48 | Standard SRAM, 64KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48 | Standard SRAM, 64KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48 | Standard SRAM, 64KX16, 120ns, CMOS, PBGA48, MICRO, BGA-48 | Standard SRAM, 64KX16, 120ns, CMOS, PBGA48, MICRO, BGA-48 | Standard SRAM, 64KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48 |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, |
Contacts | 48 | 48 | 48 | 48 | 48 | 48 |
Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 85 ns | 100 ns | 85 ns | 120 ns | 120 ns | 100 ns |
JESD-30 code | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
length | 6.3 mm | 6.3 mm | 6.3 mm | 6.3 mm | 6.3 mm | 6.3 mm |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 16 | 16 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 48 | 48 | 48 | 48 | 48 | 48 |
word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
organize | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm |
Maximum supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
width | 6.2 mm | 6.2 mm | 6.2 mm | 6.2 mm | 6.2 mm | 6.2 mm |
Maker | SK Hynix | SK Hynix | - | SK Hynix | SK Hynix | SK Hynix |
JESD-609 code | e1 | - | e1 | e1 | e1 | e1 |
Terminal surface | TIN SILVER COPPER | - | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |