HY62UF16101LLM-10 datasheet, PDF

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HY62UF16101LLM-10: DescriptionStandard SRAM, 64KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48; Categorystorage storage; File Size150KB，9 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY62UF16101LLM-10 Overview

Standard SRAM, 64KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48

HY62UF16101LLM-10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	48
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	100 ns
JESD-30 code	R-PBGA-B48
length	6.3 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	0.95 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6.2 mm
Base Number Matches	1

HY62UF16101LLM-10 Related Products

	HY62UF16101LLM-10	HY62UF16101LLM-I-85	HY62UF16101LLM-85	HY62UF16101LLM-12	HY62UF16101LLM-I-12	HY62UF16101LLM-I-10
Description	Standard SRAM, 64KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48	Standard SRAM, 64KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48	Standard SRAM, 64KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48	Standard SRAM, 64KX16, 120ns, CMOS, PBGA48, MICRO, BGA-48	Standard SRAM, 64KX16, 120ns, CMOS, PBGA48, MICRO, BGA-48	Standard SRAM, 64KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	VFBGA,
Contacts	48	48	48	48	48	48
Reach Compliance Code	compliant	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	85 ns	85 ns	120 ns	120 ns	100 ns
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
length	6.3 mm	6.3 mm	6.3 mm	6.3 mm	6.3 mm	6.3 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	48	48	48	48	48	48
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.95 mm	0.95 mm	0.95 mm	0.95 mm	0.95 mm	0.95 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	6.2 mm	6.2 mm	6.2 mm	6.2 mm	6.2 mm	6.2 mm
Maker	SK Hynix	-	SK Hynix	SK Hynix	SK Hynix	SK Hynix
JESD-609 code	-	e1	e1	e1	e1	e1
Terminal surface	-	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER

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