DATASHEET
X28HC256
256k, 32k x 8-Bit, 5V, Byte Alterable EEPROM
The
X28HC256
is a second generation high performance
CMOS 32k x 8 EEPROM. It is fabricated with Intersil’s
proprietary, textured poly floating gate technology, providing a
highly reliable 5V only nonvolatile memory.
The X28HC256 supports a 128-byte page write operation,
effectively providing a 24µs/byte write cycle, and enabling the
entire memory to be typically rewritten in less than 0.8s. The
X28HC256 also features DATA polling and Toggle bit polling,
two methods of providing early end of write detection. The
X28HC256 also supports the JEDEC standard software data
protection feature for protecting against inadvertent writes
during power-up and power-down.
Endurance for the X28HC256 is specified as a minimum
100,000 write cycles per byte and an inherent data retention
of 100 years.
FN8108
Rev 5.00
August 27, 2015
Features
• Access time: 90ns
• Simple byte and page write
- Single 5V supply
- No external high voltages or V
P-P
control circuits
- Self timed
- No erase before write
- No complex programming algorithms
- No overerase problem
• Low power CMOS
- Active: 60mA
- Standby: 500µA
• Software data protection
- Protects data against system level inadvertent writes
• High speed page write capability
• Highly reliable Direct Write
™
cell
- Endurance: 100,000 cycles
- Data retention: 100 years
• Early end of write detection
- DATA polling
- Toggle bit polling
• RoHS compliant
X BUFFERS
LATCHES AND
DECODER
A
0
TO A
14
ADDRESS
INPUTS
Y BUFFERS
LATCHES AND
DECODER
256k BIT
EEPROM
ARRAY
I/O BUFFERS
AND LATCHES
I/O
0
TO I/O
7
CE
OE
WE
V
CC
V
SS
CONTROL
LOGIC AND
TIMING
DATA INPUTS/OUTPUTS
FIGURE 1. BLOCK DIAGRAM
FN8108 Rev 5.00
August 27, 2015
Page 1 of 19
X28HC256
Ordering Information
PART NUMBER
(Note
4)
X28HC256JZ-15 (Notes
1, 3)
X28HC256JI-15 (Note
1)
X28HC256JIZ-15
(Notes
1, 3)
X28HC256PZ-15
(Notes
2, 3)
X28HC256PIZ-15
(Notes
2, 3)
X28HC256JZ-12 (Notes
1, 3)
X28HC256JI-12 (Note
1)
X28HC256JIZ-12
(Notes
1, 3)
X28HC256PZ-12
(Notes
2, 3)
X28HC256PIZ-12
(Notes
2, 3)
X28HC256SZ-12 (Note
3)
X28HC256SI-12
X28HC256SIZ-12 (Note
3)
X28HC256JZ-90 (Notes
1, 3)
X28HC256JI-90 (Note
1)
X28HC256JIZ-90
(Notes
1, 3)
X28HC256PZ-90
(Notes
2, 3)
X28HC256SI-90
X28HC256SIZ-90 (Note
3)
NOTES:
1. Add “T*” suffix for tape and reel. Please refer to
TB347
for details on reel specifications.
2. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see product information page for
X28HC256.
For more information on MSL, please see tech brief
TB363.
PART MARKING
X28HC256J-15 ZHY
X28HC256JI-15 HY
X28HC256JI-15 ZHY
X28HC256P-15 HYZ
X28HC256PI-15 HYZ
X28HC256J-12 ZHY
X28HC256JI-12 HY
X28HC256JI-12 ZHY
X28HC256P-12 HYZ
X28HC256PI-12 HYZ
X28HC256S-12 HYZ
X28HC256SI-12 HY
X28HC256SI-12 HYZ
X28HC256J-90 ZHY
X28HC256JI-90 HY
X28HC256JI-90 ZHY
X28HC256P-90 HYZ
ACCESS TIME
(ns)
150
150
150
150
150
120
120
120
120
120
120
120
120
90
90
90
90
90
90
90
TEMP. RANGE
(°C)
0 to +70
-40 to +85
-40 to +85
0 to +70
-40 to +85
0 to +70
-40 to +85
-40 to +85
0 to +70
-40 to +85
0 to +70
-40 to +85
-40 to +85
0 to +70
-40 to +85
-40 to +85
0 to +70
-40 to +85
-40 to +85
-40 to +85
32 Ld PLCC
32 Ld PLCC (RoHS Compliant)
28 Ld PDIP (RoHS Compliant)
28 Ld PDIP (RoHS Compliant)
32 Ld PLCC (RoHS Compliant)
32 Ld PLCC
32 Ld PLCC (RoHS Compliant)
28 Ld PDIP (RoHS Compliant)
28 Ld PDIP (RoHS Compliant)
28 Ld SOIC (300mils RoHS Compliant)
28 Ld SOIC (300mils)
28 Ld SOIC (300mils RoHS Compliant)
32 Ld PLCC (RoHS Compliant)
32 Ld PLCC
32 Ld PLCC (RoHS Compliant)
28 Ld PDIP (RoHS Compliant)
28 Ld PDIP (RoHS Compliant)
28 Ld SOIC (300mils)
28 Ld SOIC (300mils RoHS Compliant)
PACKAGE
32 Ld PLCC (RoHS Compliant)
PKG. DWG. #
N32.45x55
N32.45x55
N32.45x55
E28.6
E28.6
N32.45x55
N32.45x55
N32.45x55
E28.6
E28.6
MDP0027
M28.3
MDP0027
N32.45x55
N32.45x55
N32.45x55
E28.6
E28.6
M28.3
MDP0027
X28HC256PIZ-90 (Notes
2, 3)
X28HC256PI-90 HYZ
X28HC256SI-90 HY
X28HC256SI-90 HYZ
FN8108 Rev 5.00
August 27, 2015
Page 2 of 19
X28HC256
Pin Configurations
X28HC256
(28 LD FLATPACK, PDIP, SOIC)
TOP VIEW
A
14
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
I/O
0
I/O
1
I/O
2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
WE
A
13
A
8
A
9
A
11
OE
A
10
CE
I/O
7
I/O
6
I/O
5
I/O
4
I/O
2
V
SS
I/O
1
NC
I/O
3
I/O
4
I/O
3
I/O
5
A
6
A
5
A
4
A
3
A
2
A
1
A
0
NC
I/O
0
5
6
7
8
9
10
11
X28HC256
(32 LD PLCC, LCC)
TOP VIEW
NC
V
CC
A
7
A
12
A
14
WE
A
13
29
28
27
26
25
24
23
A
8
A
9
A
11
NC
OE
A
10
CE
I/O
7
I/O
6
4 3
2 1 32 31 30
12
22
13
21
14 15 16 17 18 19 20
Pin Descriptions
PIN NAME
A
0
, A
1
, A
2
, A
3
, A
4
, A
5
,
A
6
, A
7
, A
8
, A
9
, A
10
, A
11
,
A
12
, A
13
, A
14
I/O
0
, I/O
1
, I/O
2
, I/O
3
,
I/O
4
, I/O
5
, I/O
6
, I/O
7
WE
CE
PIN #
PDIP, SOIC
10, 9, 8, 7, 6, 5,
4, 3, 25, 24, 21, 23,
2, 26, 1
11, 12, 13, 15
16, 17, 18, 19
27
20
PIN #
PLCC, LCC
11, 10, 9, 8, 7, 6,
5, 4, 29, 28, 24, 27,
3, 30, 2
13, 14, 15, 18
19, 20, 21, 22
31
23
DESCRIPTION
Addresses (A
0
to A
14
) - Address inputs. The address inputs select
an 8-bit memory location during a read or write operation.
Data In/Data Out (I/O
0
to I/O
7
) - Data input/output- Data is
written to or read from the X28HC256 through the I/O pins.
Write Enable (WE) - The Write enable input controls the writing of
data to the X28HC256.
Chip Enable (CE) - The Chip enable input must be LOW to enable
all read/write operations. When CE is HIGH, power consumption is
reduced.
Output Enable (OE) - The output enable input controls the data
output buffers, and is used to initiate read operations.
+5V
Ground
No Connect
OE
V
CC
V
SS
NC
22
28
14
-
25
32
16
1, 12, 17, 26
FN8108 Rev 5.00
August 27, 2015
Page 3 of 19
X28HC256
Absolute Maximum Ratings
Voltage on any Pin with Respect to V
SS
. . . . . . . . . . . . . . . . . . . . . 1V to +7V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Thermal Information
Temperature Under Bias
X28HC256. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -10°C to +85°C
X28HC256I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see
TB493
*Pb-free PDIPs can be used for through hole wave solder processing only.
They are not intended for use in Reflow solder processing applications.
Recommended Operating Conditions
Temperature Range
Commercial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ± 10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
DC Electrical Specifications
Across recommended operating conditions, unless otherwise specified.
LIMITS
PARAMETER
V
CC
Active Current
(TTL Inputs)
V
CC
Standby Current
(TTL Inputs)
V
CC
Standby Current
(CMOS Inputs)
Input Leakage Current
Output Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
NOTES:
SYMBOL
I
CC
I
SB1
I
SB2
I
LI
I
LO
V
lL
(Note
6)
V
IH
(Note
6)
V
OL
V
OH
I
OL
= 6mA
I
OH
= -4mA
TEST CONDITIONS
CE = OE = V
IL
, WE = V
IH
, All I/O’s = open,
address inputs = 0.4V/2.4V levels at f = 10MHz
CE = V
IH
, OE = V
IL
, All I/O’s = open, other inputs = V
IH
CE = V
CC
- 0.3V, OE = GND, All I/Os = open, other
inputs = V
CC
- 0.3V
V
IN
= V
SS
to V
CC
V
OUT
= V
SS
to V
CC
, CE = V
IH
MIN
(Note
7)
TYP
(Note
5)
30
1
200
MAX
(Note
7)
60
2
500
10
10
UNIT
mA
mA
µA
µA
µA
V
V
V
V
-1
2
2.4
0.8
V
CC
+ 1
0.4
5. Typical values are for T
A
= +25°C and nominal supply voltage.
6. V
IL
minimum and V
IH
maximum are for reference only and are not tested.
7. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
Power-up Timing
PARAMETER
Power-up to Read
Power-up to Write
SYMBOL
t
PUR
, (Note
8)
t
PUW
, (Note
8)
MAX
100
5
UNIT
µs
ms
NOTE:
8. This parameter is periodically sampled and not 100% tested.
Capacitance
SYMBOL
C
I/O
(Note
8)
C
IN
(Note
8)
T
A
= +25°C, f = 1MHz, V
CC
= 5V.
TEST
Input/output capacitance
Input capacitance
CONDITIONS
V
I/O
= 0V
V
IN
= 0V
MAX
10
6
UNIT
pF
pF
Endurance and Data Retention
PARAMETER
Endurance
Data retention
MIN
100,000
100
MAX
UNIT
Cycles
Years
FN8108 Rev 5.00
August 27, 2015
Page 4 of 19
X28HC256
AC Conditions of Test
Input pulse levels
Input rise and fall times
Input and output timing levels
0V to 3V
5ns
1.5V
Symbol Table
WAVEFORM
INPUTS
Must be
steady
May change
from LOW
to HIGH
OUTPUTS
Will be
steady
Will change
from LOW
to HIGH
Will change
from HIGH
to LOW
Changing:
State Not
Known
Center Line
is High
Impedance
Mode Selection
CE
L
L
H
X
X
OE
L
H
X
L
X
WE
H
L
X
X
H
MODE
Read
Write
Standby and write
inhibit
Write inhibit
Write inhibit
I/O
D
OUT
D
IN
High Z
—
—
POWER
active
active
standby
—
—
May change
from HIGH
to LOW
Don’t Care:
Changes
Allowed
N/A
Equivalent AC Load Circuit
5V
1.92k
OUTPUT
1.37k
30pF
FIGURE 2. EQUIVALENT AC LOAD CIRCUIT
AC Electrical Specifications
PARAMETER
Read Cycle Time
Chip Enable Access Time
Address Access Time
Output Enable Access Time
CE LOW to Active Output
OE LOW to Active Output
CE HIGH to High Z Output
OE HIGH to High Z Output
Output Hold from Address Change
Across recommended operating conditions, unless otherwise specified.
X28HC256-70
SYMBOL
t
RC
t
CE
t
AA
t
OE
t
LZ
(Note
9)
t
OLZ
(Note
9)
t
HZ
(Note
9)
t
OHZ
(Note
9)
t
OH
0
0
0
35
35
0
MIN
70
70
70
35
0
0
40
40
0
MAX
X28HC256-90
MIN
90
90
90
40
0
0
50
50
0
MAX
X28HC256-12
MIN
120
120
120
50
0
0
50
50
MAX
X28HC256-15
MIN
150
150
150
50
MAX
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTE:
9. t
LZ
minimum, t
HZ
, t
OLZ
minimum and t
OHZ
are periodically sampled and not 100% tested, t
HZ
and t
OHZ
are measured with C
L
= 5pF, from the point
when CE, OE return HIGH (whichever occurs first) to the time when the outputs are no longer driven..
FN8108 Rev 5.00
August 27, 2015
Page 5 of 19
京公网安备 11010802033920号
EEWORLD
