IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA324, GREEN, PLASTIC, NFBGA-324, Microprocessor
Parameter Name | Attribute value |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | LFBGA, |
Contacts | 324 |
Reach Compliance Code | unknown |
ECCN code | 3A991.A.2 |
Address bus width | |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 26 MHz |
External data bus width | |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B324 |
JESD-609 code | e1 |
length | 15 mm |
low power mode | YES |
Number of terminals | 324 |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Maximum seat height | 1.4 mm |
speed | 500 MHz |
Maximum supply voltage | 1.15 V |
Minimum supply voltage | 1.06 V |
Nominal supply voltage | 1.1 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
width | 15 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
XAM3359ZCZA50 | XAM3359ZCZD50 | XAM3358ZCEA50 | XAM3358ZCED50 | XAM3359ZCZ50 | XAM3358ZCE50 | |
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Description | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA324, GREEN, PLASTIC, NFBGA-324, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA324, GREEN, PLASTIC, NFBGA-324, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA298, GREEN, PLASTIC, NFBGA-298, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA298, GREEN, PLASTIC, NFBGA-298, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA324, GREEN, PLASTIC, NFBGA-324, Microprocessor | IC 32-BIT, 500 MHz, RISC PROCESSOR, PBGA298, GREEN, PLASTIC, NFBGA-298, Microprocessor |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, |
Contacts | 324 | 324 | 298 | 298 | 324 | 298 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
bit size | 32 | 32 | 32 | 32 | 32 | 32 |
boundary scan | YES | YES | YES | YES | YES | YES |
maximum clock frequency | 26 MHz | 26 MHz | 26 MHz | 26 MHz | 26 MHz | 26 MHz |
Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
Integrated cache | YES | YES | YES | YES | YES | YES |
JESD-30 code | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B298 | S-PBGA-B298 | S-PBGA-B324 | S-PBGA-B298 |
JESD-609 code | e1 | e1 | e1 | e1 | e1 | e1 |
length | 15 mm | 15 mm | 13 mm | 13 mm | 15 mm | 13 mm |
low power mode | YES | YES | YES | YES | YES | YES |
Number of terminals | 324 | 324 | 298 | 298 | 324 | 298 |
Maximum operating temperature | 105 °C | 90 °C | 105 °C | 90 °C | 90 °C | 90 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
Maximum seat height | 1.4 mm | 1.4 mm | 1.3 mm | 1.3 mm | 1.4 mm | 1.3 mm |
speed | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
Maximum supply voltage | 1.15 V | 1.15 V | 1.15 V | 1.15 V | 1.15 V | 1.15 V |
Minimum supply voltage | 1.06 V | 1.06 V | 1.06 V | 1.06 V | 1.06 V | 1.06 V |
Nominal supply voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | OTHER | OTHER |
Terminal surface | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 0.8 mm | 0.8 mm | 0.65 mm | 0.65 mm | 0.8 mm | 0.65 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
width | 15 mm | 15 mm | 13 mm | 13 mm | 15 mm | 13 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |