TC55VD836FFI-143 datasheet, PDF

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TC55VD836FFI-143: DescriptionIC 256K X 36 ZBT SRAM, 4 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM; Categorystorage storage; File Size891KB，20 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC55VD836FFI-143 Overview

IC 256K X 36 ZBT SRAM, 4 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM

TC55VD836FFI-143 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	4 ns
Maximum clock frequency (fCLK)	143 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	9437184 bit
Memory IC Type	ZBT SRAM
memory width	36
Number of functions	1
Number of terminals	100
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.7 mm
Maximum standby current	0.01 A
Minimum standby current	3.14 V
Maximum slew rate	0.42 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
width	14 mm

TC55VD836FFI-143 Related Products

	TC55VD836FFI-143	TC55VD836FFI-133
Description	IC 256K X 36 ZBT SRAM, 4 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM	IC 256K X 36 ZBT SRAM, 4.2 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM
Is it Rohs certified?	incompatible	incompatible
Maker	Toshiba Semiconductor	Toshiba Semiconductor
Parts packaging code	QFP	QFP
package instruction	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	100	100
Reach Compliance Code	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A
Maximum access time	4 ns	4.2 ns
Maximum clock frequency (fCLK)	143 MHz	133 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	e0
length	20 mm	20 mm
memory density	9437184 bit	9437184 bit
Memory IC Type	ZBT SRAM	ZBT SRAM
memory width	36	36
Number of functions	1	1
Number of terminals	100	100
word count	262144 words	262144 words
character code	256000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	256KX36	256KX36
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP
Encapsulate equivalent code	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.7 mm	1.7 mm
Maximum standby current	0.01 A	0.01 A
Minimum standby current	3.14 V	3.14 V
Maximum slew rate	0.42 mA	0.4 mA
Maximum supply voltage (Vsup)	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD
width	14 mm	14 mm

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