Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 484 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 5 ns |
Other features | PIPELINED ARCHITECTURE |
JESD-30 code | S-PBGA-B484 |
JESD-609 code | e0 |
length | 23 mm |
memory density | 18874368 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 72 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 484 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX72 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
Certification status | Not Qualified |
Maximum seat height | 1.9 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |
CYD18S72AV-100BBI | CYD18S72AV-133BBC | CYD18S72AV-100BBXI | CYD18S72AV-133BBI | CYD18S72AV-100BBC | CYD18S72AV-133BBXC | CYD18S72AV-100BBXC | |
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Description | Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484 | Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484 | Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 | Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484 | Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484 | Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 | Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 |
Is it lead-free? | Contains lead | Contains lead | Lead free | Contains lead | Contains lead | Lead free | Lead free |
Is it Rohs certified? | incompatible | incompatible | conform to | incompatible | incompatible | conform to | conform to |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | BGA, | BGA, | BGA, | BGA, | BGA, | 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 | 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 |
Contacts | 484 | 484 | 484 | 484 | 484 | 484 | 484 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 5 ns | 5.5 ns | 5 ns | 5.5 ns | 5 ns | 5.5 ns | 5 ns |
Other features | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
JESD-30 code | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 |
JESD-609 code | e0 | e0 | e1 | e0 | e0 | e1 | e1 |
length | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
memory density | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit |
Memory IC Type | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
memory width | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 484 | 484 | 484 | 484 | 484 | 484 | 484 |
word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
organize | 256KX72 | 256KX72 | 256KX72 | 256KX72 | 256KX72 | 256KX72 | 256KX72 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 | 225 | 260 | 225 | 225 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm |
Maximum supply voltage (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN SILVER COPPER | TIN LEAD | TIN LEAD | TIN SILVER COPPER | TIN SILVER COPPER |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | 30 | 30 | 20 | 30 | 30 | 20 | 20 |
width | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
Maker | Cypress Semiconductor | Cypress Semiconductor | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
Humidity sensitivity level | 3 | 3 | - | 3 | 3 | - | - |