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CYD18S72AV-133BBC

Description
Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484
Categorystorage    storage   
File Size628KB,25 Pages
ManufacturerCypress Semiconductor
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CYD18S72AV-133BBC Overview

Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484

CYD18S72AV-133BBC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeBGA
package instructionBGA,
Contacts484
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time5.5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeS-PBGA-B484
JESD-609 codee0
length23 mm
memory density18874368 bit
Memory IC TypeDUAL-PORT SRAM
memory width72
Humidity sensitivity level3
Number of functions1
Number of terminals484
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX72
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height1.9 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width23 mm
Base Number Matches1

CYD18S72AV-133BBC Related Products

CYD18S72AV-133BBC CYD18S72AV-100BBXI CYD18S72AV-133BBI CYD18S72AV-100BBC CYD18S72AV-133BBXC CYD18S72AV-100BBXC CYD18S72AV-100BBI
Description Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484 Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484 Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484 Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484
Is it lead-free? Contains lead Lead free Contains lead Contains lead Lead free Lead free Contains lead
Is it Rohs certified? incompatible conform to incompatible incompatible conform to conform to incompatible
Parts packaging code BGA BGA BGA BGA BGA BGA BGA
package instruction BGA, BGA, BGA, BGA, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 BGA,
Contacts 484 484 484 484 484 484 484
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 5.5 ns 5 ns 5.5 ns 5 ns 5.5 ns 5 ns 5 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484 S-PBGA-B484
JESD-609 code e0 e1 e0 e0 e1 e1 e0
length 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm
memory density 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 72 72 72 72 72 72 72
Number of functions 1 1 1 1 1 1 1
Number of terminals 484 484 484 484 484 484 484
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 70 °C 70 °C 70 °C 85 °C
organize 256KX72 256KX72 256KX72 256KX72 256KX72 256KX72 256KX72
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 260 225 225 260 260 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.9 mm 1.9 mm 1.9 mm 1.9 mm 1.9 mm 1.9 mm 1.9 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface TIN LEAD TIN SILVER COPPER TIN LEAD TIN LEAD TIN SILVER COPPER TIN SILVER COPPER TIN LEAD
Terminal form BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 20 30 30 20 20 30
width 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm 23 mm
Maker Cypress Semiconductor - Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Humidity sensitivity level 3 - 3 3 - - 3

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