CYD18S72AV-100BBXI datasheet, PDF

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CYD18S72AV-100BBXI: DescriptionDual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484; Categorystorage storage; File Size628KB，25 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

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CYD18S72AV-100BBXI Overview

Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484

CYD18S72AV-100BBXI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	BGA,
Contacts	484
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	5 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	S-PBGA-B484
JESD-609 code	e1
length	23 mm
memory density	18874368 bit
Memory IC Type	DUAL-PORT SRAM
memory width	72
Number of functions	1
Number of terminals	484
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX72
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.9 mm
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	23 mm
Base Number Matches	1

CYD18S72AV-100BBXI Related Products

	CYD18S72AV-100BBXI	CYD18S72AV-133BBC	CYD18S72AV-133BBI	CYD18S72AV-100BBC	CYD18S72AV-133BBXC	CYD18S72AV-100BBXC	CYD18S72AV-100BBI
Description	Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484	Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484	Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484	Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484	Dual-Port SRAM, 256KX72, 5.5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484	Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484	Dual-Port SRAM, 256KX72, 5ns, CMOS, PBGA484, 23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-484
Is it lead-free?	Lead free	Contains lead	Contains lead	Contains lead	Lead free	Lead free	Contains lead
Is it Rohs certified?	conform to	incompatible	incompatible	incompatible	conform to	conform to	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	BGA,	23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484	23 X 23 MM, 1.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484	BGA,
Contacts	484	484	484	484	484	484	484
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	5 ns	5.5 ns	5.5 ns	5 ns	5.5 ns	5 ns	5 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	S-PBGA-B484	S-PBGA-B484	S-PBGA-B484	S-PBGA-B484	S-PBGA-B484	S-PBGA-B484	S-PBGA-B484
JESD-609 code	e1	e0	e0	e0	e1	e1	e0
length	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm
memory density	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	72	72	72	72	72	72	72
Number of functions	1	1	1	1	1	1	1
Number of terminals	484	484	484	484	484	484	484
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C
organize	256KX72	256KX72	256KX72	256KX72	256KX72	256KX72	256KX72
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	225	225	225	260	260	225
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.9 mm	1.9 mm	1.9 mm	1.9 mm	1.9 mm	1.9 mm	1.9 mm
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	TIN SILVER COPPER	TIN LEAD	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	20	30	30	30	20	20	30
width	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm
Maker	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Humidity sensitivity level	-	3	3	3	-	-	3

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