W9425G8EH-75 datasheet, PDF - EEWORLD Datasheet

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W9425G8EH-75: DescriptionDDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66; Categorystorage storage; File Size2MB，53 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W9425G8EH-75 Overview

DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66

W9425G8EH-75 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	TSOP2
package instruction	TSOP2, TSSOP66,.46
Contacts	66
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.75 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
interleaved burst length	2,4,8
JESD-30 code	R-PDSO-G66
length	22.22 mm
memory density	268435456 bit
Memory IC Type	DDR DRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	66
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSSOP66,.46
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	2,4,8
Maximum standby current	0.02 A
Maximum slew rate	0.3 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

W9425G8EH-75 Related Products

	W9425G8EH-75	W9425G8EH-6	W9425G8EH-5
Description	DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66	DDR DRAM, 32MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66	DDR DRAM, 32MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66
Is it Rohs certified?	conform to	conform to	conform to
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	TSOP2	TSOP2	TSOP2
package instruction	TSOP2, TSSOP66,.46	TSOP2, TSSOP66,.46	TSOP2, TSSOP66,.46
Contacts	66	66	66
Reach Compliance Code	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	0.75 ns	0.7 ns	0.7 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz	166 MHz	200 MHz
I/O type	COMMON	COMMON	COMMON
interleaved burst length	2,4,8	2,4,8	2,4,8
JESD-30 code	R-PDSO-G66	R-PDSO-G66	R-PDSO-G66
length	22.22 mm	22.22 mm	22.22 mm
memory density	268435456 bit	268435456 bit	268435456 bi
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM
memory width	8	8	8
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	66	66	66
word count	33554432 words	33554432 words	33554432 words
character code	32000000	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	32MX8	32MX8	32MX8
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	TSOP2
Encapsulate equivalent code	TSSOP66,.46	TSSOP66,.46	TSSOP66,.46
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	2.5 V	2.5 V	2.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192
Maximum seat height	1.2 mm	1.2 mm	1.2 mm
self refresh	YES	YES	YES
Continuous burst length	2,4,8	2,4,8	2,4,8
Maximum standby current	0.02 A	0.02 A	0.02 A
Maximum slew rate	0.3 mA	0.3 mA	0.3 mA
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	10.16 mm	10.16 mm

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