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XPC755BRX400LE

Description
32-BIT, 400MHz, RISC PROCESSOR, CBGA360, CERAMIC, BGA-360
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size79KB,8 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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XPC755BRX400LE Overview

32-BIT, 400MHz, RISC PROCESSOR, CBGA360, CERAMIC, BGA-360

XPC755BRX400LE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
Parts packaging codeBGA
package instructionBGA, BGA360,19X19,50
Contacts360
Reach Compliance Codeunknown
ECCN code3A991
Address bus width32
bit size32
boundary scanYES
maximum clock frequency100 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B360
JESD-609 codee0
length25 mm
low power modeYES
Number of terminals360
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Encapsulate equivalent codeBGA360,19X19,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2 V
Certification statusNot Qualified
Maximum seat height3.2 mm
speed400 MHz
Maximum supply voltage2.1 V
Minimum supply voltage1.9 V
Nominal supply voltage2 V
surface mountYES
technologyCMOS
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Advance Information
MPC755XLEPNS/D
Rev. 0, 2/2003
MPC755 Part Number
Specification for the
XPC755Bxx400LE and
XPC755CRX450LE Series
Motorola Part
Numbers Affected:
XPC755BRX400LE
XPC755BPX400LE
XPC755CRX450LE
This document describes part-number-specific changes to recommended operating conditions
and revised electrical specifications, as applicable, from those described in the general
MPC755 RISC Microprocessor Hardware Specifications
(Order No. MPC755EC/D). The
devices described in this specification are no longer in production and this document is
provided for reference only. For recommended upgrades or replacement devices, contact your
Motorola sales office.
Specifications provided in this document supersede those in the
MPC755 RISC
Microprocessor Hardware Specifications,
Rev. 6 or later, for the part numbers listed in
Table A only. Specifications not addressed herein are unchanged. Because this document is
frequently updated, refer to http://www.motorola.com/semiconductors or to your Motorola
sales office for the latest version.
Note that headings and table numbers in this document are not consecutively numbered. They
are intended to correspond to the heading or table affected in the general hardware
specification.
Part numbers addressed in this document are listed in Table A. For more detailed ordering
information, see Section 1.10, “Ordering Information.”
Table A. Part Numbers Addressed by This Data Sheet
Operating Conditions
Motorola
Part Number
CPU
Frequency
(MHz)
400
T
J
(°C)
Significant Differences from
Hardware Specification
V
DD
XPC755BRX400LE
XPC755BPX400LE
XPC755CRX450LE
2.0 V ±100 mV 0 to 105 Modified power specifications. These
devices are no longer in production.
450
Note:
The X prefix in a Motorola PowerPC part number designates a “Pilot Production Prototype” as
defined by Motorola SOP 3-13. These are from a limited production volume of prototypes
manufactured, tested, and Q.A. inspected on a qualified technology to simulate normal production.
These parts have only preliminary reliability and characterization data. Before pilot production
prototypes may be shipped, written authorization from the customer must be on file in the applicable
sales office acknowledging the qualification status and the fact that product changes may still occur
while shipping pilot production prototypes.

XPC755BRX400LE Related Products

XPC755BRX400LE XPC755BPX400LE XPC755BPX400LER2
Description 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, CERAMIC, BGA-360 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360
Parts packaging code BGA BGA BGA
package instruction BGA, BGA360,19X19,50 BGA, PLASTIC, BGA-360
Contacts 360 360 360
Reach Compliance Code unknown unknown unknown
ECCN code 3A991 3A991 3A991
Address bus width 32 32 32
bit size 32 32 32
boundary scan YES YES YES
maximum clock frequency 100 MHz 100 MHz 100 MHz
External data bus width 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES
JESD-30 code S-CBGA-B360 S-PBGA-B360 S-PBGA-B360
length 25 mm 25 mm 25 mm
low power mode YES YES YES
Number of terminals 360 360 360
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 3.2 mm 2.77 mm 2.77 mm
speed 400 MHz 400 MHz 400 MHz
Maximum supply voltage 2.1 V 2.1 V 2.1 V
Minimum supply voltage 1.9 V 1.9 V 1.9 V
Nominal supply voltage 2 V 2 V 2 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Terminal form BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM
width 25 mm 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Is it Rohs certified? incompatible - incompatible
Maker NXP - NXP
JESD-609 code e0 - e0
Encapsulate equivalent code BGA360,19X19,50 - BGA255,16X16,50
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED
power supply 2 V - 2,2.5/3.3 V
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED

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