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S29JL064H60TAI002

Description
IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,TSSOP,48PIN,PLASTIC
Categorystorage    storage   
File Size2MB,64 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric View All

S29JL064H60TAI002 Overview

IC,EEPROM,NOR FLASH,4MX16/8MX8,CMOS,TSSOP,48PIN,PLASTIC

S29JL064H60TAI002 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Reach Compliance Codecompliant
Maximum access time60 ns
Spare memory width8
startup blockBOTTOM/TOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
memory density67108864 bit
Memory IC TypeFLASH
Number of departments/size16,126
Number of terminals48
word count4194304 words
character code4000000
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
power supply3/3.3 V
Certification statusNot Qualified
ready/busyYES
Department size8K,64K
Maximum standby current0.000005 A
Maximum slew rate0.045 mA
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
switch bitYES
typeNOR TYPE

S29JL064H60TAI002 Preview

S29JL064H
64 Megabit (8 M x 8-Bit/4 M x 16-Bit)
CMOS 3.0 Volt-only, Simultaneous Read/Write
Flash Memory
DATASHEET
Distinctive Characteristics
Architectural Advantages
Simultaneous Read/Write operations
— Data can be continuously read from one bank while
executing erase/program functions in another bank.
— Zero latency between read and write operations
Flexible Bank architecture
— Read may occur in any of the three banks not being
written or erased.
— Four banks may be grouped by customer to achieve
desired bank divisions.
Boot Sectors
— Top and bottom boot sectors in the same device
— Any combination of sectors can be erased
Manufactured on 0.13 µm process technology
SecSi™ (Secured Silicon) Sector: Extra 256 Byte
sector
Factory locked and identifiable:
16 bytes available for
secure, random factory Electronic Serial Number;
verifiable as factory locked through autoselect
function.
Customer lockable:
One-time programmable only.
Once locked, data cannot be changed
Zero Power Operation
— Sophisticated power management circuits reduce
power consumed during inactive periods to nearly
zero.
Compatible with JEDEC standards
— Pinout and software compatible with single-power-
supply flash standard
Ultra low power consumption (typical values)
— 2 mA active read current at 1 MHz
— 10 mA active read current at 5 MHz
— 200 nA in standby or automatic sleep mode
Cycling Endurance: 1 million cycles per sector
typical
Data Retention: 20 years typical
Software Features
Supports Common Flash Memory Interface (CFI)
Erase Suspend/Erase Resume
— Suspends erase operations to read data from, or
program data to, a sector that is not being erased,
then resumes the erase operation.
Data# Polling and Toggle Bits
— Provides a software method of detecting the status of
program or erase cycles
Unlock Bypass Program command
— Reduces overall programming time when issuing
multiple program command sequences
Hardware Features
Ready/Busy# output (RY/BY#)
— Hardware method for detecting program or erase
cycle completion
Hardware reset pin (RESET#)
— Hardware method of resetting the internal state
machine to the read mode
WP#/ACC input pin
— Write protect (WP#) function protects sectors 0, 1,
140, and 141, regardless of sector protect status
— Acceleration (ACC) function accelerates program
timing
Sector protection
— Hardware method to prevent any program or erase
operation within a sector
— Temporary Sector Unprotect allows changing data in
protected sectors in-system
Package options
63-ball Fine Pitch BGA
48-pin TSOP
Performance Characteristics
High performance
— Access time as fast as 55 ns
— Program time: 4 µs/word typical using accelerated
programming function
Publication Number
S29JL064H_00
Revision
A
Amendment
3
Issue Date
September 16, 2004
This document contains information on a product under development at FASL LLC. The information is intended to help you evaluate this product. FASL LLC reserves the
right to change or discontinue work on this proposed product without notice.
General Description
The S29JL064H is a 64 megabit, 3.0 volt-only flash memory device, organized as
4,194,304 words of 16 bits each or 8,388,608 bytes of 8 bits each. Word mode
data appears on DQ15–DQ0; byte mode data appears on DQ7–DQ0. The device
is designed to be programmed in-system with the standard 3.0 volt V
CC
supply,
and can also be programmed in standard EPROM programmers.
The device is available with an access time of 55, 60, 70, or 90 ns and is offered
in 48-pin TSOP and 63-ball Fine Pitch BGA packages. Standard control pins—chip
enable (CE#), write enable (WE#), and output enable (OE#)—control normal
read and write operations, and avoid bus contention issues.
The device requires only a
single 3.0 volt power supply
for both read and write
functions. Internally generated and regulated voltages are provided for the pro-
gram and erase operations.
Simultaneous Read/Write Operations with Zero Latency
The Simultaneous Read/Write architecture provides
simultaneous operation
by dividing the memory space into
four banks,
two 8 Mb banks with small and
large sectors, and two 24 Mb banks of large sectors. Sector addresses are fixed,
system software can be used to form user-defined bank groups.
During an Erase/Program operation, any of the three non-busy banks may be
read from. Note that only two banks can operate simultaneously. The device can
improve overall system performance by allowing a host system to program or
erase in one bank, then immediately and simultaneously read from the other
bank, with zero latency. This releases the system from waiting for the completion
of program or erase operations.
The S29JL064H can be organized as both a top and bottom boot sector
configuration.
Bank
Bank 1
Bank 2
Bank 3
Bank 4
Megabits
8 Mb
24 Mb
24 Mb
8 Mb
Sector Sizes
Eight 8 Kbyte/4 Kword,
Fifteen 64 Kbyte/32 Kword
Forty-eight 64 Kbyte/32 Kword
Forty-eight 64 Kbyte/32 Kword
Eight 8 Kbyte/4 Kword,
Fifteen 64 Kbyte/32 Kword
S29JL064H Features
The
SecSi™ (Secured Silicon) Sector
is an extra 256 byte sector capable of
being permanently locked by FASL or customers. The SecSi Customer Indicator
Bit (DQ6) is permanently set to 1 if the part has been customer locked, and per-
manently set to 0 if the part has been factory locked. This way, customer lockable
parts can never be used to replace a factory locked part.
Factory locked parts provide several options. The SecSi Sector may store a se-
cure, random 16 byte ESN (Electronic Serial Number), customer code
(programmed through Spansion programming services), or both. Customer Lock-
able parts may utilize the SecSi Sector as bonus space, reading and writing like
any other flash sector, or may permanently lock their own code there.
2
S29JL064H
S29JL064H_00A3 September 16, 2004
DMS (Data Management Software)
allows systems to easily take advantage
of the advanced architecture of the simultaneous read/write product line by al-
lowing removal of EEPROM devices. DMS will also allow the system software to
be simplified, as it will perform all functions necessary to modify data in file struc-
tures, as opposed to single-byte modifications. To write or update a particular
piece of data (a phone number or configuration data, for example), the user only
needs to state which piece of data is to be updated, and where the updated data
is located in the system. This is an advantage compared to systems where user-
written software must keep track of the old data location, status, logical to phys-
ical translation of the data onto the Flash memory device (or memory devices),
and more. Using DMS, user-written software does not need to interface with the
Flash memory directly. Instead, the user's software accesses the Flash memory
by calling one of only six functions.
The device offers complete compatibility with the
JEDEC 42.4 sin-
gle-power-supply Flash command set standard.
Commands are written to
the command register using standard microprocessor write timings. Reading data
out of the device is similar to reading from other Flash or EPROM devices.
The host system can detect whether a program or erase operation is complete by
using the device
status bits:
RY/BY# pin, DQ7 (Data# Polling) and DQ6/DQ2
(toggle bits). After a program or erase cycle has been completed, the device au-
tomatically returns to the read mode.
The
sector erase architecture
allows memory sectors to be erased and repro-
grammed without affecting the data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection
measures include a low V
CC
detector that automat-
ically inhibits write operations during power transitions. The
hardware sector
protection
feature disables both program and erase operations in any combina-
tion of the sectors of memory. This can be achieved in-system or via
programming equipment.
The device offers two power-saving features. When addresses have been stable
for a specified amount of time, the device enters the
automatic sleep mode.
The system can also place the device into the
standby mode.
Power consump-
tion is greatly reduced in both modes.
September 16, 2004 S29JL064H_00A3
S29JL064H
3
Table Of Contents
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 10
Table 1. S29JL064H Device Bus Operations ..........................10
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 38
DQ7: Data# Polling .............................................................................. 38
Figure 6. Data# Polling Algorithm ....................................... 39
DQ6: Toggle Bit I ..................................................................................40
Figure 7. Toggle Bit Algorithm ............................................ 41
Requirements for Reading Array Data ............................................ 11
Writing Commands/Command Sequences .................................... 11
Accelerated Program Operation ...................................................... 12
Autoselect Functions ............................................................................ 12
Simultaneous Read/Write Operations with Zero Latency ....... 12
Standby Mode ......................................................................................... 12
Automatic Sleep Mode ......................................................................... 12
RESET#: Hardware Reset Pin ............................................................ 13
Output Disable Mode ........................................................................... 13
Table 2. S29JL064H Sector Architecture ...............................14
Table 3. Bank Address .......................................................17
DQ2: Toggle Bit II ................................................................................. 41
Reading Toggle Bits DQ6/DQ2 ........................................................ 42
DQ5: Exceeded Timing Limits .......................................................... 42
DQ3: Sector Erase Timer .................................................................. 42
Table 13. Write Operation Status ....................................... 43
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 44
Figure 8. Maximum Negative Overshoot Waveform................ 44
Figure 9. Maximum Positive Overshoot Waveform ................. 44
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . .44
Industrial (I) Devices ............................................................................ 44
Extended (N) Devices ......................................................................... 44
V
CC
Supply Voltages ............................................................................ 44
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 45
CMOS Compatible ............................................................................... 45
Figure 10. I
CC1
Current vs. Time (Showing Active and
Automatic Sleep Currents) ................................................. 46
Figure 11. Typical I
CC1
vs. Frequency .................................. 46
Autoselect Mode ................................................................................... 17
Table 5. S29JL064H Autoselect Codes, (High Voltage Method) 18
Sector/Sector Block Protection and Unprotection ....................18
Table 6. S29JL064H Boot Sector/Sector Block Addresses for Pro-
tection/Unprotection ..........................................................18
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 12. Test Setup ....................................................... 47
Table 14. Test Specifications ............................................. 47
Write Protect (WP#) ........................................................................... 21
Table 7. WP#/ACC Modes ..................................................21
Key To Switching Waveforms . . . . . . . . . . . . . . . . 47
Figure 13. Input Waveforms and Measurement Levels............ 47
Temporary Sector Unprotect ........................................................... 21
Figure 1. Temporary Sector Unprotect Operation................... 22
Figure 2. In-System Sector Protect/Unprotect Algorithms ....... 23
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 48
Read-Only Operations ......................................................................48
Figure 14. Read Operation Timings...................................... 48
SecSi™ (Secured Silicon) Sector
Flash Memory Region .......................................................................... 24
Figure 3. SecSi Sector Protect Verify ................................... 25
Hardware Reset (RESET#) ................................................................ 49
Figure 15. Reset Timings ................................................... 49
Hardware Data Protection ................................................................ 25
Low VCC Write Inhibit ...................................................................... 25
Write Pulse “Glitch” Protection ...................................................... 26
Logical Inhibit ......................................................................................... 26
Power-Up Write Inhibit ..................................................................... 26
Common Flash Memory Interface (CFI) . . . . . . .26
Table
Table
Table
Table
8. CFI Query Identification String ...............................27
9. System Interface String .........................................27
10. Device Geometry Definition ..................................28
11. Primary Vendor-Specific Extended Query ................29
Word/Byte Configuration (BYTE#) ................................................ 50
Figure 16. BYTE# Timings for Read Operations ..................... 51
Figure 17. BYTE# Timings for Write Operations..................... 51
Erase and Program Operations ........................................................ 52
Figure 18. Program Operation Timings ................................. 53
Figure 19. Accelerated Program Timing Diagram ................... 53
Figure 20. Chip/Sector Erase Operation Timings.................... 54
Figure 21. Back-to-back Read/Write Cycle Timings ................ 55
Figure 22. Data# Polling Timings (During
Embedded Algorithms) ...................................................... 55
Figure 23. Toggle Bit Timings (During Embedded Algorithms) . 56
Figure 24. DQ2 vs. DQ6 ..................................................... 56
Command Definitions . . . . . . . . . . . . . . . . . . . . . .30
Reading Array Data ............................................................................. 30
Reset Command ................................................................................... 30
Autoselect Command Sequence ....................................................... 31
Enter SecSi™ Sector/Exit SecSi Sector
Command Sequence ............................................................................. 31
Byte/Word Program Command Sequence .................................... 31
Unlock Bypass Command Sequence ............................................... 32
Figure 4. Program Operation .............................................. 33
Temporary Sector Unprotect .......................................................... 57
Figure 25. Temporary Sector Unprotect Timing Diagram......... 57
Figure 26. Sector/Sector Block Protect and
Unprotect Timing Diagram ................................................. 58
Alternate CE# Controlled Erase and Program Operations .... 59
Figure 27. Alternate CE# Controlled Write (Erase/Program)
Operation Timings............................................................. 60
Chip Erase Command Sequence .......................................................33
Sector Erase Command Sequence .................................................. 34
Figure 5. Erase Operation .................................................. 35
Erase Suspend/Erase Resume Commands .....................................35
Table 12. S29JL064H Command Definitions ..........................37
Erase And Programming Performance . . . . . . . . 61
TSOP & BGA Pin Capacitance . . . . . . . . . . . . . . 61
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 62
FBE063—63-Ball Fine-Pitch Ball Grid Array (BGA)
12 x 11 mm package ............................................................................... 62
TS 048—48-Pin Standard TSOP ...................................................... 63
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 64
S29JL064H_00A3 September 16, 2004
4
S29JL064H
Product Selector Guide
Part Number
Speed Option
Standard Voltage Range: V
CC
= 2.7–3.6 V
55
55
55
25
S29JL064H
60
60
60
25
70
70
70
30
90
90
90
35
Max Access Time (ns), t
ACC
CE# Access (ns), t
CE
OE# Access (ns), t
OE
Block Diagram
V
CC
V
SS
OE#
BYTE#
Mux
A21–A0
Bank 1 Address
Bank 1
Y-gate
X-Decoder
A21–A0
RY/BY#
Bank 2 Address
Bank 2
X-Decoder
A21–A0
RESET#
WE#
CE#
BYTE#
WP#/ACC
DQ0–DQ15
STATE
CONTROL
&
COMMAND
REGISTER
Status
DQ15–DQ0
DQ15–DQ0
DQ15–DQ0
Control
Mux
A21–A0
X-Decoder
Bank 3 Address
Bank 3
DQ15–DQ0
DQ15–DQ0
Y-gate
X-Decoder
A21–A0
Mux
Bank 4 Address
Bank 4
September 16, 2004 S29JL064H_00A3
S29JL064H
5
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