L7CL186HC25 datasheet, PDF - EEWORLD Datasheet

L7CL186HC25: DescriptionStandard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28; Categorystorage storage; File Size340KB，8 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L7CL186HC25 Overview

Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	0.600 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN; FLASH CLEAR
JESD-30 code	R-CDIP-T28
length	35.56 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.953 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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