H5TC4G63MFR-PBI datasheet, PDF

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H5TC4G63MFR-PBI: DescriptionDDR DRAM, 256MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96; Categorystorage storage; File Size573KB，33 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/; Environmental Compliance

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H5TC4G63MFR-PBI Overview

DDR DRAM, 256MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96

H5TC4G63MFR-PBI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SK Hynix
Parts packaging code	BGA
package instruction	TFBGA, BGA96,9X16,32
Contacts	96
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	MULTI BANK PAGE BURST
Maximum access time	0.225 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	800 MHz
I/O type	COMMON
interleaved burst length	4,8
JESD-30 code	R-PBGA-B96
length	13 mm
memory density	4294967296 bit
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	96
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-45 °C
organize	256MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA96,9X16,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.35 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	4,8
Maximum standby current	0.02 A
Maximum slew rate	0.24 mA
Maximum supply voltage (Vsup)	1.45 V
Minimum supply voltage (Vsup)	1.283 V
Nominal supply voltage (Vsup)	1.35 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	9.4 mm

H5TC4G63MFR-PBI Related Products

	H5TC4G63MFR-PBI	H5TC4G63MFR-G7I	H5TC4G63MFR-H9I	H5TC4G83MFR-PBI	H5TC4G83MFR-H9I	H5TC4G83MFR-G7I
Description	DDR DRAM, 256MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 256MX16, 0.3ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 256MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96	DDR DRAM, 512MX8, 0.225ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78	DDR DRAM, 512MX8, 0.255ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78	DDR DRAM, 512MX8, 0.3ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA, BGA96,9X16,32	TFBGA, BGA78,9X13,32	TFBGA, BGA78,9X13,32	TFBGA, BGA78,9X13,32
Contacts	96	96	96	78	78	78
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
Maximum access time	0.225 ns	0.3 ns	0.255 ns	0.225 ns	0.255 ns	0.3 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	800 MHz	533 MHz	667 MHz	800 MHz	667 MHz	533 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
interleaved burst length	4,8	4,8	4,8	4,8	4,8	4,8
JESD-30 code	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B78	R-PBGA-B78	R-PBGA-B78
length	13 mm	13 mm	13 mm	11.1 mm	11.1 mm	11.1 mm
memory density	4294967296 bit	4294967296 bit	4294967296 bit	4294967296 bit	4294967296 bit	4294967296 bit
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	16	16	16	8	8	8
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	96	96	96	78	78	78
word count	268435456 words	268435456 words	268435456 words	536870912 words	536870912 words	536870912 words
character code	256000000	256000000	256000000	512000000	512000000	512000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-45 °C	-45 °C	-45 °C	-45 °C	-45 °C	-45 °C
organize	256MX16	256MX16	256MX16	512MX8	512MX8	512MX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA96,9X16,32	BGA96,9X16,32	BGA96,9X16,32	BGA78,9X13,32	BGA78,9X13,32	BGA78,9X13,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192	8192	8192	8192
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	YES	YES	YES	YES	YES	YES
Continuous burst length	4,8	4,8	4,8	4,8	4,8	4,8
Maximum standby current	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A
Maximum slew rate	0.24 mA	0.24 mA	0.24 mA	0.17 mA	0.165 mA	0.145 mA
Maximum supply voltage (Vsup)	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V	1.45 V
Minimum supply voltage (Vsup)	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V	1.283 V
Nominal supply voltage (Vsup)	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	9.4 mm	9.4 mm	9.4 mm	9.4 mm	9.4 mm	9.4 mm

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