|
HI4P0506-5 |
HI3-0507-5Z |
HI1-0506-5 |
HI9P0506-9Z |
HI9P0509-5Z |
HI4P0506-5Z |
Description |
16-CHANNEL, SGL ENDED MULTIPLEXER, PQCC28, PLASTIC, MS-018-AB, LCC-28 |
8-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDIP28, PLASTIC, MS-011-AB, DIP-28 |
Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP28, FRIT SEALED, CERDIP-28 |
16-CHANNEL, SGL ENDED MULTIPLEXER, PDSO28, LEAD FREE, PLASTIC, MS-013-AE, SOIC-28 |
4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, PLASTIC, MS-012-AC, SOIC-16 |
16-CHANNEL, SGL ENDED MULTIPLEXER, PQCC28, LEAD FREE, PLASTIC, MS-018-AB, LCC-28 |
Maker |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Parts packaging code |
LCC |
DIP |
DIP |
SOIC |
SOIC |
LCC |
package instruction |
PLASTIC, MS-018-AB, LCC-28 |
PLASTIC, MS-011-AB, DIP-28 |
DIP, |
LEAD FREE, PLASTIC, MS-013-AE, SOIC-28 |
PLASTIC, MS-012-AC, SOIC-16 |
LEAD FREE, PLASTIC, MS-018-AB, LCC-28 |
Contacts |
28 |
28 |
28 |
28 |
16 |
28 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
Analog Integrated Circuits - Other Types |
SINGLE-ENDED MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
JESD-30 code |
S-PQCC-J28 |
R-PDIP-T28 |
R-GDIP-T28 |
R-PDSO-G28 |
R-PDSO-G16 |
S-PQCC-J28 |
Negative supply voltage minimum (Vsup) |
-10 V |
-10 V |
-10 V |
-10 V |
-10 V |
-10 V |
Nominal Negative Supply Voltage (Vsup) |
-15 V |
-15 V |
-15 V |
-15 V |
-15 V |
-15 V |
Number of channels |
16 |
8 |
16 |
16 |
4 |
16 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
28 |
28 |
28 |
28 |
16 |
28 |
Nominal off-state isolation |
68 dB |
68 dB |
68 dB |
68 dB |
68 dB |
68 dB |
On-state resistance matching specifications |
9 Ω |
9 Ω |
9 Ω |
9 Ω |
9 Ω |
9 Ω |
Maximum on-state resistance (Ron) |
400 Ω |
400 Ω |
400 Ω |
400 Ω |
400 Ω |
400 Ω |
Maximum operating temperature |
75 °C |
75 °C |
75 °C |
85 °C |
75 °C |
75 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
DIP |
DIP |
SOP |
SOP |
QCCJ |
Package shape |
SQUARE |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
Package form |
CHIP CARRIER |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
CHIP CARRIER |
Maximum seat height |
4.57 mm |
6.35 mm |
5.92 mm |
2.65 mm |
1.75 mm |
4.57 mm |
Minimum supply voltage (Vsup) |
10 V |
10 V |
10 V |
10 V |
10 V |
10 V |
Nominal supply voltage (Vsup) |
15 V |
15 V |
15 V |
15 V |
15 V |
15 V |
surface mount |
YES |
NO |
NO |
YES |
YES |
YES |
Maximum disconnect time |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
Maximum connection time |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
1000 ns |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
INDUSTRIAL |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
Terminal surface |
TIN LEAD |
MATTE TIN |
TIN LEAD |
MATTE TIN |
TIN LEAD |
MATTE TIN |
Terminal form |
J BEND |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
J BEND |
Terminal pitch |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
QUAD |
DUAL |
DUAL |
DUAL |
DUAL |
QUAD |
width |
11.505 mm |
15.24 mm |
15.24 mm |
7.5 mm |
3.9 mm |
11.505 mm |
Is it lead-free? |
Contains lead |
Lead free |
Contains lead |
Lead free |
- |
Lead free |
Is it Rohs certified? |
incompatible |
conform to |
incompatible |
conform to |
- |
conform to |
JESD-609 code |
e0 |
e3 |
e0 |
e3 |
- |
e3 |
length |
11.505 mm |
37.4 mm |
- |
17.9 mm |
9.9 mm |
11.505 mm |
Humidity sensitivity level |
3 |
NOT APPLICABLE |
- |
3 |
- |
3 |
Peak Reflow Temperature (Celsius) |
225 |
NOT APPLICABLE |
NOT APPLICABLE |
260 |
- |
NOT APPLICABLE |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT APPLICABLE |
NOT APPLICABLE |
30 |
- |
NOT APPLICABLE |