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SN74AS842JTP4

Description
SN74AS842JTP4
Categorylogic    logic   
File Size415KB,9 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SN74AS842JTP4 Overview

SN74AS842JTP4

SN74AS842JTP4 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP24,.3
Reach Compliance Codenot_compliant
JESD-30 codeR-XDIP-T24
Logic integrated circuit typeD LATCH
Number of digits10
Number of functions1
Number of terminals24
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

SN74AS842JTP4 Related Products

SN74AS842JTP4 SN74AS842NTP1 SN74AS842NT1 SN74AS842NTP3 SN74AS842ADW SN74AS842JT SN74AS842JT4 SN54AS842FH
Description SN74AS842JTP4 IC,LATCH,SINGLE,10-BIT,AS-TTL,DIP,24PIN,PLASTIC IC,LATCH,SINGLE,10-BIT,AS-TTL,DIP,24PIN,PLASTIC SN74AS842NTP3 IC,LATCH,SINGLE,10-BIT,AS-TTL,SOP,24PIN,PLASTIC IC,LATCH,SINGLE,10-BIT,AS-TTL,DIP,24PIN,CERAMIC SN74AS842JT4 IC,LATCH,SINGLE,10-BIT,AS-TTL,LLCC,28PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
JESD-30 code R-XDIP-T24 R-PDIP-T24 R-PDIP-T24 R-PDIP-T24 R-PDSO-G24 R-XDIP-T24 R-XDIP-T24 S-XQCC-N28
Logic integrated circuit type D LATCH D LATCH D LATCH D LATCH D LATCH D LATCH D LATCH D LATCH
Number of digits 10 10 10 10 10 10 10 10
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24 24 28
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 125 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP SOP DIP DIP QCCN
Encapsulate equivalent code DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 SOP24,.4 DIP24,.3 DIP24,.3 LCC28,.45SQ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE CHIP CARRIER
surface mount NO NO NO NO YES NO NO YES
technology TTL TTL TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL QUAD
package instruction DIP, DIP24,.3 - - - SOP, SOP24,.4 DIP, DIP24,.3 DIP, DIP24,.3 QCCN, LCC28,.45SQ
Certification status - Not Qualified Not Qualified - Not Qualified Not Qualified - Not Qualified
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