Fast Page DRAM Module, 1MX8, 60ns, CMOS, PSMA30
Parameter Name | Attribute value |
Maker | LAPIS Semiconductor Co., Ltd. |
package instruction | SIMM, SIM30 |
Reach Compliance Code | unknown |
Maximum access time | 60 ns |
I/O type | COMMON |
JESD-30 code | R-PSMA-N30 |
memory density | 8388608 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 8 |
Number of terminals | 30 |
word count | 1048576 words |
character code | 1000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SIMM |
Encapsulate equivalent code | SIM30 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum seat height | 16.51 mm |
Maximum standby current | 0.0004 A |
Maximum slew rate | 0.2 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 2.54 mm |
Terminal location | SINGLE |
MSC23108CL-60DS2 | MSC23108CL-70DS2 | |
---|---|---|
Description | Fast Page DRAM Module, 1MX8, 60ns, CMOS, PSMA30 | Fast Page DRAM Module, 1MX8, 70ns, CMOS, PSMA30 |
package instruction | SIMM, SIM30 | SIMM, SIM30 |
Reach Compliance Code | unknown | unknown |
Maximum access time | 60 ns | 70 ns |
I/O type | COMMON | COMMON |
JESD-30 code | R-PSMA-N30 | R-PSMA-N30 |
memory density | 8388608 bit | 8388608 bit |
Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
memory width | 8 | 8 |
Number of terminals | 30 | 30 |
word count | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 |
Maximum operating temperature | 70 °C | 70 °C |
organize | 1MX8 | 1MX8 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SIMM | SIMM |
Encapsulate equivalent code | SIM30 | SIM30 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
refresh cycle | 1024 | 1024 |
Maximum seat height | 16.51 mm | 16.51 mm |
Maximum standby current | 0.0004 A | 0.0004 A |
Maximum slew rate | 0.2 mA | 0.18 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | SINGLE | SINGLE |