S5440W datasheet, PDF - EEWORLD Datasheet

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S5440W: DescriptionNAND Gate, TTL, CDFP14; Categorylogic logic; File Size151KB，3 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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S5440W Overview

NAND Gate, TTL, CDFP14

S5440W Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DFP, FL14,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F14
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.048 A
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL14,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Maximum supply current (ICC)	27 mA
Prop。Delay @ Nom-Sup	22 ns
Certification status	Not Qualified
Schmitt trigger	NO
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL

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S5440W Related Products

	S5440W	S54LS40W	N74LS40A	S5440W/883B	N7440F	N74LS40FB	S5440F
Description	NAND Gate, TTL, CDFP14	NAND Gate, TTL, CDFP14	NAND Gate, TTL, PDIP14	NAND Gate, TTL, CDFP14	NAND Gate, TTL, CDIP14	NAND Gate, TTL, CDIP14	NAND Gate, TTL, CDIP14
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL14,.3	DFP, FL14,.3	DIP, DIP14,.3	DFP, FL14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F14	R-XDFP-F14	R-PDIP-T14	R-XDFP-F14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.048 A	0.024 A	0.024 A	0.048 A	0.048 A	0.024 A	0.048 A
Number of terminals	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	70 °C	125 °C	70 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-	-55 °C	-	-	-55 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DFP	DIP	DFP	DIP	DIP	DIP
Encapsulate equivalent code	FL14,.3	FL14,.3	DIP14,.3	FL14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	IN-LINE	FLATPACK	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	27 mA	6 mA	6 mA	27 mA	27 mA	6 mA	27 mA
Prop。Delay @ Nom-Sup	22 ns	24 ns	24 ns	22 ns	22 ns	24 ns	22 ns
Schmitt trigger	NO	NO	NO	NO	NO	NO	NO
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	FLAT	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified

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