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N7440F

Description
NAND Gate, TTL, CDIP14
Categorylogic    logic   
File Size151KB,3 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

N7440F Overview

NAND Gate, TTL, CDIP14

N7440F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.048 A
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Maximum supply current (ICC)27 mA
Prop。Delay @ Nom-Sup22 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

N7440F Related Products

N7440F S54LS40W N74LS40A S5440W/883B N74LS40FB S5440W S5440F
Description NAND Gate, TTL, CDIP14 NAND Gate, TTL, CDFP14 NAND Gate, TTL, PDIP14 NAND Gate, TTL, CDFP14 NAND Gate, TTL, CDIP14 NAND Gate, TTL, CDFP14 NAND Gate, TTL, CDIP14
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP14,.3 DFP, FL14,.3 DIP, DIP14,.3 DFP, FL14,.3 DIP, DIP14,.3 DFP, FL14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-XDFP-F14 R-PDIP-T14 R-XDFP-F14 R-XDIP-T14 R-XDFP-F14 R-XDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
MaximumI(ol) 0.048 A 0.024 A 0.024 A 0.048 A 0.024 A 0.048 A 0.048 A
Number of terminals 14 14 14 14 14 14 14
Maximum operating temperature 70 °C 125 °C 70 °C 125 °C 70 °C 125 °C 125 °C
Minimum operating temperature - -55 °C - -55 °C - -55 °C -55 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DFP DIP DFP DIP DFP DIP
Encapsulate equivalent code DIP14,.3 FL14,.3 DIP14,.3 FL14,.3 DIP14,.3 FL14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE FLATPACK IN-LINE FLATPACK IN-LINE FLATPACK IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Maximum supply current (ICC) 27 mA 6 mA 6 mA 27 mA 6 mA 27 mA 27 mA
Prop。Delay @ Nom-Sup 22 ns 24 ns 24 ns 22 ns 24 ns 22 ns 22 ns
Schmitt trigger NO NO NO NO NO NO NO
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES NO YES NO
technology TTL TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL MILITARY COMMERCIAL MILITARY COMMERCIAL MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE FLAT THROUGH-HOLE FLAT THROUGH-HOLE FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified

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