NAND Gate, TTL, CDIP14
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T14 |
JESD-609 code | e0 |
Logic integrated circuit type | NAND GATE |
MaximumI(ol) | 0.048 A |
Number of terminals | 14 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum supply current (ICC) | 27 mA |
Prop。Delay @ Nom-Sup | 22 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
N7440F | S54LS40W | N74LS40A | S5440W/883B | N74LS40FB | S5440W | S5440F | |
---|---|---|---|---|---|---|---|
Description | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDFP14 | NAND Gate, TTL, PDIP14 | NAND Gate, TTL, CDFP14 | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDFP14 | NAND Gate, TTL, CDIP14 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T14 | R-XDFP-F14 | R-PDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-XDFP-F14 | R-XDIP-T14 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
MaximumI(ol) | 0.048 A | 0.024 A | 0.024 A | 0.048 A | 0.024 A | 0.048 A | 0.048 A |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C |
Minimum operating temperature | - | -55 °C | - | -55 °C | - | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DFP | DIP | DFP | DIP | DFP | DIP |
Encapsulate equivalent code | DIP14,.3 | FL14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Maximum supply current (ICC) | 27 mA | 6 mA | 6 mA | 27 mA | 6 mA | 27 mA | 27 mA |
Prop。Delay @ Nom-Sup | 22 ns | 24 ns | 24 ns | 22 ns | 24 ns | 22 ns | 22 ns |
Schmitt trigger | NO | NO | NO | NO | NO | NO | NO |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | YES | NO | YES | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |