DM74S571BVX datasheet, PDF - EEWORLD Datasheet

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DM74S571BVX: Description512X4 OTPROM, 35ns, PQCC20, PLASTIC, LCC-20; Categorystorage storage; File Size124KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74S571BVX Overview

512X4 OTPROM, 35ns, PQCC20, PLASTIC, LCC-20

DM74S571BVX Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	QLCC
package instruction	QCCJ,
Contacts	20
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	35 ns
JESD-30 code	S-PQCC-J20
length	8.89 mm
memory density	2048 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	20
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm

DM74S571BVX Related Products

	DM74S571BVX	DM54S571J	DM54S571J/883B	DM54S571J/883	DM54S571AJ	DM54S571BJ	DM74S571AVX	DM74S571VX
Description	512X4 OTPROM, 35ns, PQCC20, PLASTIC, LCC-20	IC 512 X 4 OTPROM, 65 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM	512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 60ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 45ns, PQCC20, PLASTIC, LCC-20	512X4 OTPROM, 55ns, PQCC20, PLASTIC, LCC-20
Parts packaging code	QLCC	DIP	DIP	DIP	DIP	DIP	QLCC	QLCC
package instruction	QCCJ,	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	QCCJ,	QCCJ,
Contacts	20	16	16	16	16	16	20	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	35 ns	65 ns	65 ns	65 ns	60 ns	50 ns	45 ns	55 ns
JESD-30 code	S-PQCC-J20	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	S-PQCC-J20	S-PQCC-J20
length	8.89 mm	19.43 mm	19.43 mm	19.43 mm	19.43 mm	19.43 mm	8.89 mm	8.89 mm
memory density	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	20	16	16	16	16	16	20	20
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-
organize	512X4	512X4	512X4	512X4	512X4	512X4	512X4	512X4
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	DIP	DIP	DIP	DIP	DIP	QCCJ	QCCJ
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	4.57 mm	4.57 mm
Maximum supply voltage (Vsup)	5.25 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	NO	NO	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD
width	8.89 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	8.89 mm	8.89 mm
Maker	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Output characteristics	3-STATE	3-STATE	-	-	3-STATE	3-STATE	3-STATE	3-STATE
Is it lead-free?	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	-	-
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	-	-
JESD-609 code	-	e0	e0	e0	e0	e0	-	-
Encapsulate equivalent code	-	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	-	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-
power supply	-	5 V	5 V	5 V	5 V	5 V	-	-
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-

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