512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 65 ns |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| length | 19.43 mm |
| memory density | 2048 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 16 |
| word count | 512 words |
| character code | 512 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512X4 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| DM54S571J/883 | DM54S571J | DM54S571J/883B | DM54S571AJ | DM54S571BJ | DM74S571AVX | DM74S571VX | DM74S571BVX | |
|---|---|---|---|---|---|---|---|---|
| Description | 512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16 | IC 512 X 4 OTPROM, 65 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM | 512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16 | 512X4 OTPROM, 60ns, CDIP16, CERAMIC, DIP-16 | 512X4 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16 | 512X4 OTPROM, 45ns, PQCC20, PLASTIC, LCC-20 | 512X4 OTPROM, 55ns, PQCC20, PLASTIC, LCC-20 | 512X4 OTPROM, 35ns, PQCC20, PLASTIC, LCC-20 |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | QLCC | QLCC | QLCC |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCJ, | QCCJ, | QCCJ, |
| Contacts | 16 | 16 | 16 | 16 | 16 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 65 ns | 65 ns | 65 ns | 60 ns | 50 ns | 45 ns | 55 ns | 35 ns |
| JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | S-PQCC-J20 | S-PQCC-J20 | S-PQCC-J20 |
| length | 19.43 mm | 19.43 mm | 19.43 mm | 19.43 mm | 19.43 mm | 8.89 mm | 8.89 mm | 8.89 mm |
| memory density | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 20 | 20 | 20 |
| word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - |
| organize | 512X4 | 512X4 | 512X4 | 512X4 | 512X4 | 512X4 | 512X4 | 512X4 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | QCCJ | QCCJ | QCCJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | YES | YES | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 8.89 mm |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - | - | - |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | - | - | - |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | - | - | - |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - | - | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| Output characteristics | - | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
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