DM54S571AJ datasheet, PDF - EEWORLD Datasheet

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DM54S571AJ: Description512X4 OTPROM, 60ns, CDIP16, CERAMIC, DIP-16; Categorystorage storage; File Size124KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM54S571AJ Overview

512X4 OTPROM, 60ns, CDIP16, CERAMIC, DIP-16

DM54S571AJ Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	60 ns
JESD-30 code	R-GDIP-T16
JESD-609 code	e0
length	19.43 mm
memory density	2048 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	16
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512X4
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.13 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

DM54S571AJ Related Products

	DM54S571AJ	DM54S571J	DM54S571J/883B	DM54S571J/883	DM54S571BJ	DM74S571AVX	DM74S571VX	DM74S571BVX
Description	512X4 OTPROM, 60ns, CDIP16, CERAMIC, DIP-16	IC 512 X 4 OTPROM, 65 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM	512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 65ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16	512X4 OTPROM, 45ns, PQCC20, PLASTIC, LCC-20	512X4 OTPROM, 55ns, PQCC20, PLASTIC, LCC-20	512X4 OTPROM, 35ns, PQCC20, PLASTIC, LCC-20
Parts packaging code	DIP	DIP	DIP	DIP	DIP	QLCC	QLCC	QLCC
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	QCCJ,	QCCJ,	QCCJ,
Contacts	16	16	16	16	16	20	20	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	60 ns	65 ns	65 ns	65 ns	50 ns	45 ns	55 ns	35 ns
JESD-30 code	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	S-PQCC-J20	S-PQCC-J20	S-PQCC-J20
length	19.43 mm	19.43 mm	19.43 mm	19.43 mm	19.43 mm	8.89 mm	8.89 mm	8.89 mm
memory density	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	20	20	20
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-
organize	512X4	512X4	512X4	512X4	512X4	512X4	512X4	512X4
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	QCCJ	QCCJ	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	4.57 mm	4.57 mm	4.57 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	YES	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	8.89 mm	8.89 mm	8.89 mm
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	-	-	-
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	-	-	-
Maker	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
JESD-609 code	e0	e0	e0	e0	e0	-	-	-
Output characteristics	3-STATE	3-STATE	-	-	3-STATE	3-STATE	3-STATE	3-STATE
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	-	-	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	-
power supply	5 V	5 V	5 V	5 V	5 V	-	-	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	-

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